Inventor
Masakuni Shiozawa
Inventor
Chino, JP
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
H05KPrinted circuits18%
B23KSoldering or unsoldering10%
G01RMeasuring electric variables10%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
Y10TTechnical subjects covered by former us classification5%
H03HImpedance networks, e.g. resonant circuits3%
Y02PClimate change mitigation technologies in the production or processing of goods3%
PatentTitleYear
8,816,709'Electronic component testing device and electronic component transport method'20148,558,570'Component test apparatus and component transport method'20138,008,939'Component test apparatus and component transport method'20117,888,928'Component test apparatus having a pair of rotary transport hands'20117,562,806'Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device'20097,410,826'Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device'20087,371,607'Method of manufacturing semiconductor device and method of manufacturing electronic device'20087,256,072'Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device'20077,195,935'Selective packaging of tested semiconductor devices'20077,017,636'Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device'20066,984,125'Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device'20066,638,785'Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making'20036,566,763'Interconnect substrate, apparatus of applying adhesive material, semiconductor device, circuit board and electronic instrument'20036,512,294'Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making the same'20036,391,686'Adhesive material applying method and apparatus, interconnect substrate, semiconductor device and manufacturing method thereof, circuit board and electronic instrument'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2014Patents assigned to SEIKO EPSON CORP (15)· patent assignee history
2002–2008Based in Sakata, JP· patent location history
2003–2008Based in Suwa, JP· patent location history
2006–2013Based in Chino, JP· patent location history
2013–2014Patents assigned to SHIOZAWA MASAKUNI (2)· patent assignee history
2013Patents assigned to FUJIMORI HIROAKI (1)· patent assignee history
2014Based in Nagano, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SEIKO EPSON CORP | 15 | 2002–2014 |
| SHIOZAWA MASAKUNIself | 2 | 2013–2014 |
| FUJIMORI HIROAKI | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chino, JP | 5 | 2006–2013 |
| Sakata, JP | 5 | 2002–2008 |
| Suwa, JP | 4 | 2003–2008 |
| Nagano, JP | 1 | 2014 |