Inventor
GUN LEE
Inventor
KR
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H05KPrinted circuits9%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems5%
PatentTitleYear
12,568,839Semiconductor package and method of fabricating the same202612,463,104Semiconductor package and method for manufacturing the same202512,341,118Semiconductor package including an encapsulant202512,272,666Semiconductor package and method of manufacturing the same202512,154,859Semiconductor package and method of manufacturing same202411,837,537Fan-out semiconductor package202311,756,867Power module including lead frame unit connecting first substrate and second substrate202311,735,557Power module of double-faced cooling2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to SAMSUNG ELECTRONICS CO LTD (6)· patent assignee history
2023Patents assigned to LG ELECTRONICS INC (2)· patent assignee history
2023Patents assigned to LG MAGNA E POWERTRAIN CO LTD (1)· patent assignee history
2023–2026Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 6 | 2023–2026 |
| LG ELECTRONICS INC | 2 | 2023 |
| LG MAGNA E POWERTRAIN CO LTD | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 8 | 2023–2026 |