Inventor
You GE
Inventor
CN
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices44%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1044%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
PatentTitleYear
12,051,642QFN semiconductor package, semiconductor package and lead frame202411,984,408Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation202411,515,238Power die package202211,456,188Method of making flexible semiconductor device with graphene tape2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to NXP USA INC (4)· patent assignee history
2022–2024Based in CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NXP USA INC | 4 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 4 | 2022–2024 |