Inventor
Gary F. Goth
Inventor
Pleasant Valley, NY, US
Overview
Patents· 55 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits26%
F25BRefrigeration machines, plants or systems14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
G06FElectric digital data processing10%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications10%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application9%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact4%
F04DNon-positive-displacement pumps2%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems2%
Y10TTechnical subjects covered by former us classification2%
PatentTitleYear
10,660,239Cooling system with integrated fill and drain pump20209,918,409'Cooling system with integrated fill and drain pump'20189,894,807'Changeable, airflow venting cover assembly for an electronics rack'20189,861,013'Cooling system with integrated fill and drain pump'20189,639,105'Thermal management in a multi-phase power system'20179,606,562'Thermal management in a multi-phase power system'20179,313,930'Multi-level redundant cooling system for continuous cooling of an electronic system(s)'20169,313,931'Multi-level redundant cooling method for continuous cooling of an electronic system(s)'20169,273,906'Modular pumping unit(s) facilitating cooling of electronic system(s)'20168,514,575'Multimodal cooling apparatus for an electronic system'20138,385,067'In-line memory and circuit board cooling system'20138,125,780'In-line memory module cooling system'20128,018,718'Multiple chip module cooling system and method of operation thereof'20117,808,783'Multiple chip module cooling system and method of operation thereof'20107,803,664'Apparatus and methods for cooling semiconductor integrated circuit package structures'20107,734,444'Systems and arrangements to assess thermal performance'20107,715,215'Control of an AC-to-DC power supply assembly fed by a three-phase AC source'20107,651,890'Method and apparatus for prevention of solder corrosion'20107,394,659'Apparatus and methods for cooling semiconductor integrated circuit package structures'20087,378,603'Enhanced blind-mated input/output card cassette packaging concept'20087,338,818'Systems and arrangements to assess thermal performance'20087,119,433'Packaging for enhanced thermal and structural performance of electronic chip modules'20067,113,401'System for airflow management in electronic enclosures'20067,088,583'System for airflow management in electronic enclosures'20066,968,709'System and method for cooling multiple logic modules'20056,923,014'System for cooling multiple logic molecules'20056,829,145'Separable hybrid cold plate and heat sink device and method'20046,760,221'Evaporator with air cooling backup'20046,698,218'Method for controlling multiple refrigeration units'20046,698,216'Method for controlling a refrigeration unit for evaporator maintenance'20046,662,577'Method for operating a logic module refrigeration unit'20036,644,053'Method for starting a refrigeration unit'20036,644,048'Method for shutting down a refrigerating unit'20036,644,056'Method of controlling a refrigeration unit'20036,595,018'Logic module refrigeration system with condensation control'20036,564,563'Logic module refrigeration system with condensation control'20036,485,311'Compression connector actuation system'20026,446,447'Logic module refrigeration system with condensation control'2002D0448369'Electronic data processing equipment cabinet'20016,192,701'Sealed multi-chip module cooling system'20016,167,621'Center feed parallel flow cold plate dual refrigeration systems'20016,053,238'Center feed parallel flow cold plate for dual refrigeration systems'20006,035,655'Modular refrigeration system'20006,034,872'Cooling computer systems'20005,970,731'Modular refrigeration system'19995,963,425'Combined air and refrigeration cooling for computer systems'19995,954,127'Cold plate for dual refrigeration system'19995,934,364'Cold plate for dual refrigeration systems'19995,896,922'Cold plate for dual refrigeration systems'19995,699,853'Combined heat sink and sink plate'19975,228,502'Cooling by use of multiple parallel convective surfaces'19935,170,319'Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels'19925,161,089'Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same'19925,005,638'Thermal conduction module with barrel shaped piston for improved heat transfer'19914,460,893'Method and apparatus for detecting abnormal metal-to-metal contact in a journal bearing'1984Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1984–2020Based in Pleasant Valley, NY, US· patent location history
1991–2020Patents assigned to IBM (53)· patent assignee history
2012–2016Patents assigned to GOTH GARY F (4)· patent assignee history
2012–2013Patents assigned to PIZZOLATO KATIE L (2)· patent assignee history
2013–2016Patents assigned to MULLADY ROBERT K (2)· patent assignee history
2013–2016Patents assigned to VANDEVENTER ALLAN C (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 53 | 1991–2020 |
| GOTH GARY Fself | 4 | 2012–2016 |
| MULLADY ROBERT K | 2 | 2013–2016 |
| PIZZOLATO KATIE L | 2 | 2012–2013 |
| VANDEVENTER ALLAN C | 2 | 2013–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Pleasant Valley, New York, US | 55 | 1984–2020 |