Inventor

CHUEI-TANG WANG

Inventor

TW

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 111 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%

H01LSemiconductor devices27%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%

H10DInorganic electric semiconductor devices8%

H01QAntennas, i.e. radio aerials6%

G02BOptical elements, systems or apparatus4%

H10BElectronic memory devices2%

G01RMeasuring electric variables1%

H01FMagnets1%

H10NElectric solid-state devices not otherwise provided for1%

PatentTitleYear

12,599,009Package structure2026 12,588,222Semiconductor package including an integrated circuit die and an inductor or a transformer2026 12,560,829Photonic semiconductor device and method2026 12,546,935Integrated circuit package and method of forming same2026 12,538,851Memory packages and methods of forming same2026 12,517,301Photon source and optical computing architecture2026 12,512,424Package, package structure and method of manufacturing the same2025 12,512,405Semiconductor package and method of manufacturing the same2025 12,504,588Semiconductor device and methods of manufacture2025 12,489,062Semiconductor package and manufacturing method thereof2025 12,469,808Semiconductor package and manufacturing method thereof2025 12,417,991Chip stack structure with conductive plug and method for forming the same2025 12,412,799Integrated circuit package and method2025 12,412,852Polymer layers embedded with metal pads for heat dissipation2025 12,345,935Package assembly and manufacturing method thereof2025 12,341,106Package structure2025 12,334,457Integrated fan-out package2025 12,327,796Architecture for computing system package2025 12,322,691Package structure and method of manufacturing the same2025 12,322,705Chip package and manufacturing method thereof2025 12,315,854Integrated circuit package and method2025 12,300,575Semiconductor package and method2025 12,278,214Integrated circuit package and method2025 12,272,691Semiconductor and circuit structures, and related methods2025 12,272,616Heat-dissipating structures for semiconductor devices and methods of manufacture2025 12,266,673Semiconductor package and method of forming the same2025 12,218,006System, device and methods of manufacture2025 12,191,270Integrated circuit package and method of forming same2025 12,174,415Semiconductor package and manufacturing method thereof2024 12,165,952Interposer directly bonded to bonding pads on a plurality of dies2024 12,136,593Electronic apparatus including antennas and directors2024 12,125,812Integrated circuit packages and methods of forming the same2024 12,125,824Semiconductor stack structure and manufacturing method thereof2024 12,125,798Semiconductor package and method2024 12,100,698Semiconductor device and manufacturing method thereof2024 12,094,860Package structure and manufacturing method thereof2024 12,087,757Integrated circuit packages2024 12,080,684Die stacks and methods forming same2024 12,068,295Deep partition power delivery with deep trench capacitor2024 12,057,407Semiconductor package and method2024 12,051,649Architecture for computing system package2024 12,046,480Manufacturing method of a semiconductor device2024 12,040,566Antenna device2024 12,040,281Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof2024 12,033,963Package structure comprising thermally conductive layer around the IC die2024 12,021,047Semiconductor packages having a die, an encapsulant, and a redistribution structure2024 11,984,668Method of embedding low-k materials in antennas2024 11,948,926Integrated circuit package and method2024 11,929,333Integrated fan-out package2024 11,923,315Semiconductor package and manufacturing method thereof2024 11,908,787Package structure and method of manufacturing the same2024 11,854,928Semiconductor package and manufacturing method thereof2023 11,855,046Memory packages and methods of forming same2023 11,848,235System, device and methods of manufacture2023 11,841,541Package assembly and manufacturing method thereof2023 11,830,841Semiconductor package and method for manufacturing the same2023 11,830,864Photonic semiconductor device and method2023 11,784,172Deep partition power delivery with deep trench capacitor2023 11,776,905Package structure, package-on-package structure and manufacturing method thereof2023 11,769,731Architecture for computing system package2023 11,764,823Method of using integrated transmitter and receiver front end module2023 11,735,576Integrated circuit package and method2023 11,728,327Integrated circuit package and method2023 11,682,583Through-vias and methods of forming the same2023 11,676,906Chip package and manufacturing method thereof2023 11,646,313Semiconductor and circuit structures, and related methods2023 11,637,097Method of manufacturing package structure2023 11,631,658Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device2023 11,621,244Integrated circuit package and method2023 11,605,622Photonic semiconductor device and method2023 11,600,431InFO coil on metal plate with slot2023 11,587,916Package structure and manufacturing method thereof2023 11,562,926Package structure and method of forming thereof2023 11,532,565System on integrated chips and methods of forming the same2022 11,532,868Antenna apparatus and method2022 11,532,533Integrated circuit package and method2022 11,527,486Semiconductor device with shield for electromagnetic interference2022 11,495,573Package structure and manufacturing method thereof2022 11,488,909Package structure2022 11,482,788Antenna device and method for manufacturing antenna device2022 11,460,633Semiconductor package and manufacturing method thereof2022 11,456,249Package structure, package-on-package structure and manufacturing method thereof2022 11,456,251Semiconductor structure, package structure, and manufacturing method thereof2022 11,450,628Package structure including a solenoid inductor laterally aside a die and method of fabricating the same2022 11,424,197Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same2022 11,417,698Semiconductor package and method of forming the same2022 11,410,923Semiconductor device, integrated fan-out package and method of forming the same2022 11,404,316System, device and methods of manufacture2022 11,398,440Polymer layers embedded with metal pads for heat dissipation2022 11,387,222Integrated circuit package and method2022 11,380,655Die stacks and methods forming same2022 11,362,077Photonic semiconductor device and method2022 11,348,886Integrated fan-out package2022 11,335,767Package structure and method of fabricating the same2022 11,322,470Optical semiconductor package and method for manufacturing the same2022 11,315,891Methods of forming semiconductor packages having a die with an encapsulant2022 11,302,649Semiconductor device with shielding structure for cross-talk reduction2022 11,289,449Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof2022 11,282,810Integrated fan-out package and manufacturing method thereof2022 11,282,816Memory packages and methods of forming same2022 11,264,316Package structure and method of manufacturing the same2022 11,244,896Package structure and manufacturing method thereof2022 11,244,939Package structure and method of forming the same2022 11,239,157Package structure and package-on-package structure2022 11,222,883Package structure and method of manufacturing the same2022 11,211,339Semiconductor device2021 11,211,371Integrated circuit package and method2021 11,211,358Packaged semiconductor devices and packaging methods2021 11,211,360Passive device module, semiconductor package including the same, and manufacturing method thereof2021 11,195,817Semiconductor package and manufacturing method thereof2021 11,139,206Semiconductor device with conductive shielding structure2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (110)· patent assignee history

2021Patents assigned to TAIWWAN SEMICONDUCTOR MFG COMPANY LTD (1)· patent assignee history

2021–2026Based in TW· patent location history

2023Patents assigned to TAIWAN SEMICONDUCTOR MFG HSINCHU CO LTD (1)· patent assignee history

2026Patents assigned to TAIWAN SEMICONDUCTOR MFG COMPANY LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	110	2021–2026
TAIWAN SEMICONDUCTOR MFG COMPANY LTD	1	2026
TAIWAN SEMICONDUCTOR MFG HSINCHU CO LTD	1	2023
TAIWWAN SEMICONDUCTOR MFG COMPANY LTD	1	2021

Locations

Location	Patents	Span
TW	111	2021–2026