Inventor
Ying-Ru Shih
Inventor
Hsinchu, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10DInorganic electric semiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
C23CCoating metallic material5%
C30BSingle-crystal growth5%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution5%
Y02PClimate change mitigation technologies in the production or processing of goods5%
PatentTitleYear
10,629,718III-nitride epitaxial structure202010,510,830N-type polysilicon crystal, manufacturing method thereof, and N-type polysilicon wafer201910,490,432Wafer carrier201910,475,637Semiconductor substrate and manufacturing method thereof201910,103,108Nanostructured chip and method of producing the same20189,611,548'Wafer rotating apparatus'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2020Patents assigned to GLOBALWAFERS CO LTD (5)· patent assignee history
2017–2020Based in Hsinchu, TW· patent location history
2019Patents assigned to SINO AMERICAN SILICON PROD INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GLOBALWAFERS CO LTD | 5 | 2017–2020 |
| SINO AMERICAN SILICON PROD INC | 1 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 6 | 2017–2020 |