Inventor
Ming-Horn Tsai
Inventor
Hsinchu, TW
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Bprimary
G01BMeasuring length, thickness or similar linear dimensions20%
G01RMeasuring electric variables20%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
PatentTitleYear
8,629,435'Methods of extracting fin heights and overlap capacitance and structures for performing the same'20146,033,962'Method of fabricating sidewall spacers for a self-aligned contact hole'20005,631,112'Multiple exposure method for photo-exposing photosensitive layers upon high step height topography substrate layers'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2000Patents assigned to VANGUARD INT SEMICONDUCT CORP (2)· patent assignee history
1997–2000Based in Hsinchu, TW· patent location history
2014Patents assigned to LIU HSIAO-HAN (1)· patent assignee history
2014Patents assigned to TAIWAN SEMICONDUCTOR MFG (1)· patent assignee history
2014Patents assigned to TSAI MING-HORN (1)· patent assignee history
2014Based in Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| VANGUARD INT SEMICONDUCT CORP | 2 | 1997–2000 |
| LIU HSIAO-HAN | 1 | 2014 |
| TAIWAN SEMICONDUCTOR MFG | 1 | 2014 |
| TSAI MING-HORNself | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 2 | 1997–2000 |
| Taipei, TW | 1 | 2014 |