Inventor
Michael C. Garner
Inventor
Pleasanton, CA, US
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
G06FElectric digital data processing13%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
C30BSingle-crystal growth8%
H10DInorganic electric semiconductor devices8%
Y10TTechnical subjects covered by former us classification8%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
B07CPostal sorting3%
G06KGraphical data reading3%
PatentTitleYear
10,990,950Systems and methods of product recognition through multi-model image processing202110,430,728Systems and methods for applying secondary information to business addresses20198,370,165'Methods and systems for providing an alternative delivery point code'20138,280,745'Systems and methods for applying secondary information to business addresses'20128,140,551'Address matching'20127,553,694'Methods of forming a high conductivity diamond film and structures formed thereby'20097,501,330'Methods of forming a high conductivity diamond film and structures formed thereby'20097,432,532'Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat'20087,417,255'Methods of forming a high conductivity diamond film and structures formed thereby'20087,170,098'Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat'20077,031,959'Address matching'20066,921,706'Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat'20056,785,134'Embedded liquid pump and microchannel cooling system'20046,770,966'Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2009Patents assigned to INTEL CORP (7)· patent assignee history
2004–2009Based in Pleasanton, CA, US· patent location history
2006–2013Patents assigned to US POSTAL SERVICE (4)· patent assignee history
2006–2019Based in Collierville, TN, US· patent location history
2009–2019Patents assigned to GARNER MICHAEL C (5)· patent assignee history
2012–2019Patents assigned to SNAPP ROBERT F (3)· patent assignee history
2012–2019Patents assigned to WILSON JAMES D (3)· patent assignee history
2021Based in Centerton, AR, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 7 | 2004–2009 |
| GARNER MICHAEL Cself | 5 | 2009–2019 |
| US POSTAL SERVICE | 4 | 2006–2013 |
| SNAPP ROBERT F | 3 | 2012–2019 |
| WILSON JAMES D | 3 | 2012–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Pleasanton, California, US | 8 | 2004–2009 |
| Collierville, TN, US | 5 | 2006–2019 |
| Centerton, AR, US | 1 | 2021 |