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Inventor

Jyun-Siang Peng

Inventor
Hsinchu, TW

Overview

3→
Patents
2020–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers13%
H10NElectric solid-state devices not otherwise provided for13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
PatentTitleYear
11,127,701Method of manufacturing intergrated fan-out package with redistribution structure202111,088,068Semiconductor packages and methods of manufacturing the same202110,536,780Piezoelectric transducer2020

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2020Patents assigned to MERRY ELECTRONICS SHENZHEN CO LTD (1)· patent assignee history
2020Based in Taichung, TW· patent location history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2021Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD22021
MERRY ELECTRONICS SHENZHEN CO LTD12020
Locations
LocationPatentsSpan
Hsinchu, TW22021
Taichung, TW12020