Inventor

CHIA-TIEN WU

Inventor

TW

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 52 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices33%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%

H10DInorganic electric semiconductor devices17%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%

G11CStatic stores2%

H10BElectronic memory devices2%

G06FElectric digital data processing1%

PatentTitleYear

12,581,934Semiconductor structure and manufacturing method thereof2026 12,575,397Metal lines of hybrid heights2026 12,494,411Integrated circuit and method of forming the same2025 12,476,197Semiconductor device2025 12,417,980First metal structure, layout, and method2025 12,412,804Semiconductor structure with improved heat dissipation2025 12,400,964Integrated circuit2025 12,394,633Method of fabricating semiconductor device with reduced trench distortions2025 12,388,016Deep lines and shallow lines in signal conducting paths2025 12,388,009Semiconductor device including structure connecting frontside and backside metal and method of manufacturing the same2025 12,381,145Signal conducting line arrangements in integrated circuits2025 12,368,106Diagonal vias in semiconductor structures2025 12,300,623Integrated circuit2025 12,283,586Integrated circuit device, method and system2025 12,283,477Method of manufacturing a semiconductor device2025 12,278,143Method of providing a workpiece including low resistance interconnect low-resistance interconnect2025 12,230,534Semiconductor device and method of manufacture2025 12,183,671Hybrid metal line structure2024 12,125,795Integrated chip with inter-wire cavities2024 12,094,816Semiconductor structure having deep metal line and method for forming the semiconductor structure2024 12,080,593Barrier-less structures2024 12,062,652Zero mask high density capacitor2024 12,058,852Semiconductor device and method of operating the same2024 12,002,709Interconnect structure and manufacturing method for the same2024 11,984,359Semiconductor device with spacers for self aligned vias2024 11,984,355Method for manufacturing an interconnection structure having a bottom via spacer2024 11,967,560Integrated circuit2024 11,923,306Semiconductor structure having air gaps and method for manufacturing the same2024 11,923,273Method of manufacturing a semiconductor device2024 11,916,017Signal conducting line arrangements in integrated circuits2024 11,916,077Method for routing local interconnect structure at same level as reference metal line2024 11,894,238Method of fabricating semiconductor device with reduced trench distortions2024 11,854,786Deep lines and shallow lines in signal conducting paths2023 11,848,190Barrier-less structures2023 11,842,967Semiconductor devices with backside power distribution network and frontside through silicon via2023 11,842,966Integrated chip with inter-wire cavities2023 11,817,392Integrated circuit2023 11,769,695Semiconductor structure including low-resistance interconnect and integrated circuit device having the same2023 11,764,106Semiconductor device and method of manufacture2023 11,729,969Semiconductor device and method of operating the same2023 11,715,636Method of manufacturing a semiconductor device2023 11,682,618Hybrid metal line structure2023 11,640,924Structure and method for interconnection with self-alignment2023 11,637,064Advanced metal connection with metal cut2023 11,581,298Zero mask high density capacitor2023 11,488,861Method for manufacturing an interconnect structure having a selectively formed bottom via2022 11,482,473Semiconductor device, and associated method and system2022 11,387,113Method of fabricating semiconductor device with reduced trench distortions2022 11,264,277Semiconductor device with spacers for self aligned vias2022 11,257,673Dual spacer metal patterning2022 11,257,670Method of manufacturing a semiconductor device, and associated semiconductor device and system2022 11,158,580Semiconductor devices with backside power distribution network and frontside through silicon via2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (52)· patent assignee history

2021–2026Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	52	2021–2026

Locations

Location	Patents	Span
TW	52	2021–2026