Inventor

TZE-LIANG LEE

Inventor

TW

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 118 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices27%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%

H10DInorganic electric semiconductor devices17%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%

C23CCoating metallic material4%

B82YSpecific uses or applications of nanostructures2%

C04BLime, magnesia1%

C07FAcyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium1%

G01VGeophysics1%

PatentTitleYear

12,598,767Dielectric layers for semiconductor devices and methods of forming the same2026 12,564,028Dielectric layers having nitrogen-containing crusted surfaces2026 12,557,572Method for manufacturing a semiconductor device2026 12,557,620Transistor contacts and methods of forming the same2026 12,512,408Semiconductor devices including backside power via and methods of forming the same2025 12,494,368Photoresist and method2025 12,487,523In-situ deposition and densification treatment for metal-comprising resist layer2025 12,463,034Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern2025 12,453,144Semiconductor device comprising first etch stop layer over first conductive feature over source/drain region2025 12,438,041Interconnect structure and method of forming the same2025 12,417,948Hybrid film scheme for self-aligned contact2025 12,408,367Semiconductor device2025 12,387,974Patterning interconnects and other structures by photo-sensitizing method2025 12,374,616Semiconductor device and method for manufacturing the same2025 12,374,548Photoresist layer outgassing prevention2025 12,368,098Methods of forming semiconductor device2025 12,347,726Interconnect structures and methods of forming the same2025 12,341,011Method for forming and using mask2025 12,322,590Semiconductor device and method2025 12,324,185Semiconductor device, FinFET device and methods of forming the same2025 12,322,647Semiconductor devices and methods2025 12,315,726Semiconductor device and method2025 12,308,283Method for forming interconnect structure2025 12,308,309Semiconductor device with integrated metal-insulator-metal capacitors2025 12,310,070Semiconductor device and method of manufacturing the same2025 12,302,595Dummy hybrid film for self-alignment contact formation2025 12,293,916Surface oxidation control of metal gates using capping layer2025 12,283,617Interconnect features with sharp corners and method forming same2025 12,271,113Method of manufacturing a semiconductor device2025 12,272,554Method of manufacturing a semiconductor device2025 12,261,036Forming low-stress silicon nitride layer through hydrogen treatment2025 12,255,095Semiconductor structure and manufacturing method thereof2025 12,255,240Topology selective and sacrificial silicon nitride layer for generating spacers for a semiconductor device drain2025 12,255,138Interconnect structures of semiconductor device and methods of forming the same2025 12,237,224Semiconductor device and method2025 12,237,419Gate structures in transistor devices and methods of forming same2025 12,230,567Semiconductor structure and manufacturing method thereof2025 12,222,643Method of manufacturing a semiconductor device and pattern formation method2025 12,217,971Method for forming semiconductor device2025 12,211,924Semiconductor device and method of forming the same2025 12,211,766Highly protective wafer edge sidewall protection layer2025 12,205,824Patterning material including silicon-containing layer and method for semiconductor device fabrication2025 12,198,979Semiconductor device with multi-layer etch stop structure2025 12,183,577Metal hard masks for reducing line bending2024 12,159,787Method of manufacturing a semiconductor device and pattern formation method2024 12,153,346Photoresist for semiconductor fabrication2024 12,154,973Fin field-effect transistor device and method2024 12,142,651Integrated circuit multi-gate transistors structure with gate via and manufacturing method thereof2024 12,142,608Semiconductor device and method for making the same2024 12,135,501Method of manufacturing a semiconductor device2024 12,125,911Method of modulating stress of dielectric layers2024 12,110,587Deposition apparatus and method with EM radiation2024 12,107,163Semiconductor device structure having dislocation stress memorization and methods of forming the same2024 12,094,930Integrated circuit structure and method for forming the same2024 12,087,644Methods of determining process recipes and forming a semiconductor device2024 12,087,838Self-aligned contact hard mask structure of semiconductor device and method of forming same2024 12,074,058Patterning methods for semiconductor devices2024 12,057,315Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern2024 12,051,735Dielectric spacer to prevent contacting shorting2024 12,046,475Surface oxidation control of metal gates using capping layer2024 12,044,966Photoresist for semiconductor fabrication2024 12,033,890Patterning interconnects and other structures by photo-sensitizing method2024 12,027,423Forming isolation regions for separating fins and gate stacks2024 12,014,922Apparatus for manufacturing a thin film and a method therefor2024 12,002,675Photoresist layer outgassing prevention2024 12,002,865Interconnect features with sharp corners and method forming same2024 11,984,485Semiconductor device, FinFET device and methods of forming the same2024 11,978,641Wafer bonding method and semiconductor structure obtained by the same2024 11,973,027Semiconductor device and methods of forming the same2024 11,948,798Semiconductor device and method2024 11,929,281Reducing oxidation by etching sacrificial and protection layer separately2024 11,929,329Damascene process using cap layer2024 11,923,294Interconnect structures of semiconductor device and methods of forming the same2024 11,901,409Semiconductor device and method of manufacturing the same2024 11,894,435Contact plug structure of semiconductor device and method of forming same2024 11,887,851Method for forming and using mask2024 11,854,798Semiconductor device and method2023 11,848,231Method for forming semiconductor device with multi-layer etch stop structure2023 11,842,922Method for forming interconnect structure2023 11,830,727Forming low-stress silicon nitride layer through hydrogen treatment2023 11,824,120Method of fabricating a source/drain recess in a semiconductor device2023 11,822,237Method of manufacturing a semiconductor device2023 11,798,984Seamless gap fill2023 11,784,046Method of manufacturing a semiconductor device2023 11,773,506Wafer susceptor with improved thermal characteristics2023 11,749,752Doping profile for strained source/drain region2023 11,749,756Method for manufacturing semiconductor device2023 11,742,399Topology selective and sacrificial silicon nitride layer for generating spacers for a semiconductor device drain2023 11,726,405Photoresist for semiconductor fabrication2023 11,725,278Systems and methods for a plasma enhanced deposition of material on a semiconductor substrate2023 11,715,640Patterning material including silicon-containing layer and method for semiconductor device fabrication2023 11,705,332Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern2023 11,676,852Patterning methods for semiconductor devices2023 11,676,855Patterning interconnects and other structures by photo-sensitizing method2023 11,670,546Semiconductor structure and manufacturing method thereof2023 11,670,500Treatment system and method2023 11,652,106Semiconductor device and method for making the same2023 11,588,030Integrated circuit structure and manufacturing method thereof2023 11,502,196Stress modulation for dielectric layers2022 11,482,411Semiconductor device and method2022 11,441,221Method of performing atomic layer deposition2022 11,437,515Source and drain stressors with recessed top surfaces2022 11,437,277Forming isolation regions for separating fins and gate stacks2022 11,411,109MOS devices having epitaxy regions with reduced facets2022 11,395,373Wafer holder with tapered region2022 11,393,674Forming low-stress silicon nitride layer through hydrogen treatment2022 11,373,947Methods of forming interconnect structures of semiconductor device2022 11,342,444Dielectric spacer to prevent contacting shorting2022 11,328,952Interconnect structure and method2022 11,289,417Semiconductor device and methods of forming the same2022 11,282,712Method for preventing bottom layer wrinkling in a semiconductor device2022 11,282,742Semiconductor device with multi-layer etch stop structure and method for forming the same2022 11,271,083Semiconductor device, FinFET device and methods of forming the same2022 11,257,951Method of making semiconductor device having first and second epitaxial materials2022 11,244,822Apparatus for manufacturing a thin film and a method therefor2022 11,239,310Seamless gap fill2022 11,164,789Method for forming semiconductor device that includes covering metal gate with multilayer dielectric2021 11,164,948Field-effect transistor and method of manufacturing the same2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (118)· patent assignee history

2021–2026Based in TW· patent location history

2025Patents assigned to TAIWAN SEMICODUCTOR MFG COMPANY LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	118	2021–2026
TAIWAN SEMICODUCTOR MFG COMPANY LTD	1	2025

Locations

Location	Patents	Span
TW	118	2021–2026