Inventor
James H. Knapp
Inventor
Chandler, AZ, US
Overview
Patents· 31 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
G02BOptical elements, systems or apparatus13%
B29CShaping or joining of plastics8%
H05KPrinted circuits8%
B23KSoldering or unsoldering4%
C23FNon-mechanical removal of metallic material from surface4%
C23GCleaning or de-greasing of metallic material by chemical methods other than electrolysis4%
Y10TTechnical subjects covered by former us classification4%
B05CApparatus for applying fluent materials to surfaces, in general2%
B29DProducing particular articles from plastics or from substances in a plastic state2%
PatentTitleYear
8,574,961'Method of marking a low profile packaged semiconductor device'20137,227,240'Semiconductor device with wire bond inductor and method'20077,109,064'Method of forming a semiconductor package and leadframe therefor'20066,835,580'Direct chip attach structure and method'20046,833,290'Structure and method of forming a multiple leadframe semiconductor device'20046,747,341'Integrated circuit and laminated leadframe package'20046,713,317'Semiconductor device and laminated leadframe package'20046,677,672'Structure and method of forming a multiple leadframe semiconductor device'20046,300,679'Flexible substrate for packaging a semiconductor component'20016,116,791'Optical coupler and method for coupling an optical fiber to an optoelectric device'20006,093,972'Microelectronic package including a polymer encapsulated die'20006,081,031'Semiconductor package consisting of multiple conductive layers'20005,973,337'Ball grid device with optically transmissive coating'19995,933,558'Optoelectronic device and method of assembly'19995,928,595'Method of manufacturing a semiconductor component'19995,900,669'Semiconductor component'19995,895,229'Microelectronic package including a polymer encapsulated die, and method for forming same'19995,883,996'Electronic component for aligning a light transmitting structure'19995,834,062'Material transfer apparatus and method of using the same'19985,768,456'Optoelectronic package including photonic device mounted in flexible substrate'19985,761,364'Optical waveguide'19985,659,648'Polyimide optical waveguide having electrical conductivity'19975,637,264'Method of fabricating an optical waveguide'19975,529,682'Method for making semiconductor devices having electroplated leads'19965,468,910'Semiconductor device package and method of making'19955,319,242'Semiconductor package having an exposed die surface'19945,182,071'Method of molding a carrier ring to leads'19935,118,271'Apparatus for encapsulating a semiconductor device'19924,975,146'Plasma removal of unwanted material'19904,877,482'Nitride removal method'19894,795,077'Bonding method and apparatus'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989–2000Patents assigned to MOTOROLA INC (21)· patent assignee history
1989–2013Based in Gilbert, AZ, US· patent location history
1994–2001Based in Chandler, AZ, US· patent location history
2000–2013Patents assigned to SEMICONDUCTOR COMPONENTS IND (10)· patent assignee history
2013Patents assigned to ANDERSON HAROLD G (1)· patent assignee history
2013Patents assigned to KNAPP JAMES HOWARD (1)· patent assignee history
2013Patents assigned to YODER JAY A (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MOTOROLA INC | 21 | 1989–2000 |
| SEMICONDUCTOR COMPONENTS IND | 10 | 2000–2013 |
| ANDERSON HAROLD G | 1 | 2013 |
| KNAPP JAMES HOWARDself | 1 | 2013 |
| YODER JAY A | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 18 | 1994–2001 |
| Gilbert, AZ, US | 13 | 1989–2013 |