Inventor
Chia-Wei Wu
Inventor
Taichung, TW
Overview
Patents· 31 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H10BElectronic memory devices16%
H10DInorganic electric semiconductor devices14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
C09KMaterials for miscellaneous applications, not provided for elsewhere5%
G06FElectric digital data processing5%
G01RMeasuring electric variables3%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
G02BOptical elements, systems or apparatus1%
PatentTitleYear
10,867,803Semiconductor device and method202010,861,855Semiconductor device and method of manufacturing the same202010,817,047Tracking system and tacking method using the same202010,761,423Chemical composition for tri-layer removal202010,658,365Semiconductor device and method of manufacturing the same202010,658,179Method and structure of middle layer removal202010,636,798Semiconductor device and method for fabricating the same202010,608,093Semiconductor device and method of forming the same202010,490,556Semiconductor device and method for fabricating the same201910,483,108Semiconductor device and method of manufacture201910,332,889Method of manufacturing a semiconductor device201910,312,106Semiconductor device and method201910,204,915Method of forming dynamic random access memory (DRAM)20199,558,273'System and method for generating influencer scores'20179,465,478'Driving algorithm on projected capacitance touch'20169,246,015'Vertical channel transistor structure and manufacturing method thereof'20168,466,508'Non-volatile memory structure including stress material between stacked patterns'20138,211,806'Method of fabricating integrated circuit with small pitch'20127,971,177'Design tool for charge trapping memory using simulated programming operations'20117,898,274'Structure of probe'20117,889,556'Flash memory having insulating liners between source/drain lines and channels'20117,811,890'Vertical channel transistor structure and manufacturing method thereof'20107,795,891'Tester with low signal attenuation'20107,795,088'Method for manufacturing memory cell'20107,776,713'Etching solution, method of surface modification of semiconductor substrate and method of forming shallow trench isolation'20107,668,010'Flash memory having insulating liners between source/drain lines and channels'20107,629,265'Cleaning method for use in semiconductor device fabrication'20097,588,443'Board-to-board electrical connector assembly'20097,521,321'Method of fabricating a non-volatile semiconductor memory device'20097,442,620'Methods for forming a trench isolation structure with rounded corners in a silicon substrate'20087,224,231'Method for transforming output signals of a low-noise amplifier of a wireless transceiver'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2011Based in Taipei, TW· patent location history
2008–2016Patents assigned to MACRONIX INT CO LTD (12)· patent assignee history
2008–2020Based in Taichung, TW· patent location history
2009–2016Based in Jhubei City, TW· patent location history
2010–2013Based in Hsinchu, TW· patent location history
2012–2016Patents assigned to WU CHIA-WEI (3)· patent assignee history
2019–2020Patents assigned to FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD (7)· patent assignee history
2019–2020Patents assigned to UNITED MICROELECTRONICS CORP (7)· patent assignee history
2019–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2019–2020Based in Miao-Li County, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MACRONIX INT CO LTD | 12 | 2008–2016 |
| FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD | 7 | 2019–2020 |
| UNITED MICROELECTRONICS CORP | 7 | 2019–2020 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2019–2020 |
| WU CHIA-WEIself | 3 | 2012–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taichung, TW | 9 | 2008–2020 |
| Jhubei City, TW | 7 | 2009–2016 |
| Miao-Li County, TW | 4 | 2019–2020 |
| Hsinchu, TW | 3 | 2010–2013 |
| Taipei, TW | 3 | 2007–2011 |