Inventor
Linus E. Wallgren
Inventor
Rockville, MD, US
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering32%
H05KPrinted circuits20%
F24SSolar heat collectors8%
G05DSystems for controlling or regulating non-electric variables8%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications8%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution8%
Y10TTechnical subjects covered by former us classification8%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
H02SGeneration of electric power by conversion of infrared radiation, visible light or ultraviolet light, e.g. using photovoltaic [pv] modules4%
PatentTitleYear
8,726,897'Collapsible solar module support system and method for assembling the same'20148,272,176'Methods of assembling solar energy collecting modules'20126,932,895'Automated electrophoresis gel manipulation apparatus'20055,241,156'Hand-held heating device for electrical component installation/removal and improved tips for use therewith'19935,152,447'Hot gas jet device for installing and removing components with respect to a substrate and improved tip for use therewith'19924,855,572'Heater for use as either primary or auxiliary heat source and improved circuitry for controlling the heater'19894,847,471'Heater for use as either primary or auxiliary heat source and improved circuitry for controlling the heater'19894,779,790'Job oriented method and apparatus utilizing molten solder for procedures such as soldering and desoldering'19884,697,729'Tip for removing components from a substrate'19874,666,076'Curved tip for solder extractor'19874,659,002'Apparatus for replacement of through-hole mounted PCB components'1987D0289036'Ornamental design for a frame of edge connectors utilized to replace damaged connectors on printed circuit boards'1987D0288556'Ornamental design for a frame of circuit elements utilized to replace damaged elements on printed circuit boards'1987D0288436'Frame of dual in line package pads utilized to replace damaged pads on printed circuit boards'1987Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1987–1993Patents assigned to PACE INC (8)· patent assignee history
1987Patents assigned to PACE INCORPORATED (3)· patent assignee history
1987–1993Based in Rockville, MD, US· patent location history
2005Patents assigned to LARGE SCALE PROTEOMICS CORP (1)· patent assignee history
2005–2014Based in Bethesda, MD, US· patent location history
2012–2014Patents assigned to SUNEDISON LLC (2)· patent assignee history
2012–2014Patents assigned to WALLGREN LINUS ERIC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| PACE INC | 8 | 1987–1993 |
| PACE INCORPORATED | 3 | 1987 |
| SUNEDISON LLC | 2 | 2012–2014 |
| WALLGREN LINUS ERICself | 2 | 2012–2014 |
| LARGE SCALE PROTEOMICS CORP | 1 | 2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Rockville, Maryland, US | 11 | 1987–1993 |
| Bethesda, Maryland, US | 3 | 2005–2014 |