Inventor
Re Ching Lin
Inventor
Taoyuan, TW
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices21%
H03HImpedance networks, e.g. resonant circuits21%
H10NElectric solid-state devices not otherwise provided for14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
G01KMeasuring temperature7%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems7%
B81BMicrostructural devices or systems, e.g. micromechanical devices5%
G01CMeasuring distances, levels or bearings5%
H10HInorganic light-emitting semiconductor devices having potential barriers5%
G01NInvestigating or analysing materials by determining their chemical or physical properties2%
PatentTitleYear
10,756,625Integrated module of acoustic wave device with active thermal compensation and an active thermal compensating method thereof202010,727,741Thermal sensing acoustic wave resonator and acoustic wave filter having thermal sensing acoustic wave resonator202010,498,310Protective cover for an acoustic wave device and fabrication method thereof201910,453,805Protection structure for semiconductor device package201910,298,203Protection structure for semiconductor device package201910,103,624Thermal sensor circuit201810,097,156Resonance structure of bulk acoustic wave resonator20189,998,087Acoustic wave device structure, integrated structure of power amplifier and acoustic wave device20189,905,610'Integrated structures of acoustic wave device and varactor, and acoustic wave device, varactor and power amplifier, and fabrication methods thereof'20189,653,516'Acoustic wave device structure, integrated structure of power amplifier and acoustic wave device, and fabrication methods thereof'20179,391,239'Light emitting diode'20169,231,168'Light emitting diode package structure'20169,140,671'Quantitative sensor and manufacturing method thereof'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015Patents assigned to CHANG WEI-TSAI (1)· patent assignee history
2015Patents assigned to CHEN YING-CHUNG (1)· patent assignee history
2015Patents assigned to CHENG CHIEN-CHUAN (1)· patent assignee history
2015Based in Kaohsiung, TW· patent location history
2016Patents assigned to IND TECH RES INST (2)· patent assignee history
2016Based in Taichung, TW· patent location history
2017–2020Patents assigned to WIN SEMICONDUCTORS CORP (10)· patent assignee history
2017–2018Based in Tao Yuan Shien, TW· patent location history
2018–2020Based in Taoyuan, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| WIN SEMICONDUCTORS CORP | 10 | 2017–2020 |
| IND TECH RES INST | 2 | 2016 |
| CHANG WEI-TSAI | 1 | 2015 |
| CHEN YING-CHUNG | 1 | 2015 |
| CHENG CHIEN-CHUAN | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taoyuan, TW | 7 | 2018–2020 |
| Tao Yuan Shien, TW | 3 | 2017–2018 |
| Taichung, TW | 2 | 2016 |
| Kaohsiung, TW | 1 | 2015 |