LexDanaLexDanabeta
Inventor

WEN-PING HSU

Inventor
TW

Overview

2→
Patents
2026
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices33%
H05KPrinted circuits33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
12,564,056Inner lead structure of flexible circuit board202612,550,764Layout structure of flexible circuit board2026

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2026Patents assigned to CHIPBOND TECHNOLOGY CORP (2)· patent assignee history
2026Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHIPBOND TECHNOLOGY CORP22026
Locations
LocationPatentsSpan
TW22026