Inventor
Kevin W. Hutto
Inventor
Kuna, ID, US
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
H01LSemiconductor devices13%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation13%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering10%
B08BCleaning in general6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
H05KPrinted circuits3%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
9,666,638'Methods for forming backside illuminated image sensors with front side metal redistribution layers'20179,362,330'Methods for forming backside illuminated image sensors with front side metal redistribution layers and a permanent carrier layer'20168,987,874'Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces'20158,794,050'Fluid sample analysis systems'20148,697,473'Methods for forming backside illuminated image sensors with front side metal redistribution layers'20148,568,535'Systems and methods for exposing semiconductor workpieces to vapors for through-hole cleaning and/or other processes'20138,492,198'Microelectronic workpieces with stand-off projections and methods for manufacturing microelectronic devices using such workpieces'20138,314,498'Isolated bond pad with conductive via interconnect'20128,221,557'Systems and methods for exposing semiconductor workpieces to vapors for through-hole cleaning and/or other processes'20127,928,582'Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces'20117,560,371'Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2015Patents assigned to MICRON TECHNOLOGY INC (6)· patent assignee history
2009–2017Based in Kuna, ID, US· patent location history
2012–2014Patents assigned to HUTTO KEVIN W (5)· patent assignee history
2012–2014Patents assigned to BORTHAKUR SWARNAL (3)· patent assignee history
2012–2014Patents assigned to APTINA IMAGING CORP (2)· patent assignee history
2012Patents assigned to DANDO ROSS (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 6 | 2009–2015 |
| HUTTO KEVIN Wself | 5 | 2012–2014 |
| BORTHAKUR SWARNAL | 3 | 2012–2014 |
| APTINA IMAGING CORP | 2 | 2012–2014 |
| DANDO ROSS | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kuna, ID, US | 11 | 2009–2017 |