LexDanaLexDanabeta
Inventor

Nobuya Makino

Inventor
Anjo, JP

Overview

3→
Patents
2007–2008
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1060%
B23KSoldering or unsoldering40%
PatentTitleYear
7,470,996'Packaging method'20087,405,478'Substrate package structure and packaging method thereof'20087,285,854'Wire bonding method and semiconductor device'2007

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007–2008Patents assigned to DENSO CORP (3)· patent assignee history
2007–2008Based in Anjo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
DENSO CORP32007–2008
Locations
LocationPatentsSpan
Anjo, JP32007–2008