Inventor
LIPU KRIS CHUANG
Inventor
TW
Overview
Patents· 12 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1031%
H10BElectronic memory devices3%
PatentTitleYear
12,588,549Integrated circuit package and method202612,557,681Semiconductor package and method of manufacturing the same202612,438,007Staggered metal mesh on backside of device die and method forming same202512,400,936Stacked memory cube with integrated thermal path for enhanced heat dissipation202512,255,196Semiconductor package with thermal relaxation block and manufacturing method thereof202511,984,372Integrated circuit package and method202411,830,866Semiconductor package with thermal relaxation block and manufacturing method thereof202311,749,640Semiconductor package and method of manufacturing the same202311,551,999Memory device and manufacturing method thereof202311,450,581Integrated circuit package and method202211,309,302Manufacturing method of semiconductor package including thermal conductive block202211,205,636Semiconductor package and method of manufacturing the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (12)· patent assignee history
2021–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 12 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 12 | 2021–2026 |