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Inventor

Hong Chuan Liao

Inventor
Shanghai, CN

Overview

3→
Patents
2019–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics17%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts17%
B29LIndexing scheme associated with subclass b29c, relating to particular articles17%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form17%
Y10TTechnical subjects covered by former us classification17%
G06FElectric digital data processing8%
G06TImage data processing or generation, in general8%
PatentTitleYear
10,990,409Control flow mechanism for execution of graphics processor instructions using active channel packing202110,576,717Insulation film and method for making insulation film202010,300,684Insulation film and method for making insulation film2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019–2020Patents assigned to ILLINOIS TOOL WORKS (2)· patent assignee history
2019–2020Based in Shanghai, CN· patent location history
2021Patents assigned to INTEL CORP (1)· patent assignee history
2021Based in Beijing, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ILLINOIS TOOL WORKS22019–2020
INTEL CORP12021
Locations
LocationPatentsSpan
Shanghai, CN22019–2020
Beijing, CN12021