Inventor
Hisamitsu Kamenaga
Inventor
Ishikawa, JP
Overview
Patents· 1 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering25%
H03HImpedance networks, e.g. resonant circuits25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
Y10TTechnical subjects covered by former us classification25%
PatentTitleYear
6,757,946'Wire bonding method'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004Patents assigned to MURATA MANUFACTURING CO (1)· patent assignee history
2004Based in Ishikawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MURATA MANUFACTURING CO | 1 | 2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ishikawa, JP | 1 | 2004 |