Inventor
KAORU TANAKA
Inventor
JP
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B21Bprimary
B21BRolling of metal13%
B21CManufacture of metal sheets, wire, rods, tubes, profiles or like semi-manufactured products otherwise than by rolling13%
G01BMeasuring length, thickness or similar linear dimensions13%
G01SRadio direction-finding13%
G06NComputing arrangements based on specific computational models13%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
LOC1713%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Patents assigned to SONY SEMICONDUCTOR SOLUTIONS CORP (1)· patent assignee history
2022–2025Based in JP· patent location history
2024Patents assigned to JFE STEEL CORP (1)· patent assignee history
2025Patents assigned to YAMAHA CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| JFE STEEL CORP | 1 | 2024 |
| SONY SEMICONDUCTOR SOLUTIONS CORP | 1 | 2022 |
| YAMAHA CORP | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 3 | 2022–2025 |