Inventor

Igor Y. Khandros

Inventor

Orinda, CA, US

Overview

1982–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 197 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%

G01RMeasuring electric variables14%

H05KPrinted circuits12%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%

Y10TTechnical subjects covered by former us classification11%

B23KSoldering or unsoldering8%

H01RElectrically-conductive connections7%

Y02PClimate change mitigation technologies in the production or processing of goods6%

C25DProcesses for the electrolytic or electrophoretic production of coatings5%

C23CCoating metallic material3%

PatentTitleYear

10,690,628Pens for biological micro-objects2020 10,245,588Providing DEP manipulation devices and controllable electrowetting devices in the same microfluidic apparatus2019 9,857,333'Pens for biological micro-objects'2018 9,227,200'Microfluidic devices with flexible optically transparent electrodes'2016 9,030,222'Sharpened, oriented contact tip structures'2015 8,513,969'Apparatus and method of testing singulated dies'2013 8,485,418'Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out'2013 8,373,428'Probe card assembly and kit, and methods of making same'2013 8,324,725'Stacked die module'2012 8,149,007'Carbon nanotube spring contact structures with mechanical and electrical components'2012 8,033,838'Microelectronic contact structure'2011 7,948,252'Multilayered probe card'2011 7,920,989'Remote test facility with wireless interface to local test facilities'2011 7,880,489'Printing of redistribution traces on electronic component'2011 7,868,632'Composite motion probing'2011 7,821,255'Test system with wireless communications'2010 7,798,822'Microelectronic contact structures'2010 7,731,503'Carbon nanotube contact structures'2010 7,733,106'Apparatus and method of testing singulated dies'2010 7,714,598'Contact carriers (tiles) for populating larger substrates with spring contacts'2010 7,714,235'Lithographically defined microelectronic contact structures'2010 7,701,243'Electronic device testing using a probe tip having multiple contact features'2010 7,688,090'Wafer-level burn-in and test'2010 7,675,311'Wireless test system'2010 7,616,016'Probe card assembly and kit'2009 7,613,591'Remote test facility with wireless interface to local facilities'2009 7,601,039'Microelectronic contact structure and method of making same'2009 7,579,269'Microelectronic spring contact elements'2009 7,579,856'Probe structures with physically suspended electronic components'2009 7,557,596'Test assembly including a test die for testing a semiconductor product die'2009 7,550,842'Integrated circuit assembly'2009 7,548,055'Testing an electronic device using test data from a plurality of testers'2009 7,534,654'Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component'2009 7,479,792'Methods for making plated through holes usable as interconnection wire or probe attachments'2009 7,463,043'Methods of probing an electronic device'2008 7,400,157'Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes'2008 7,352,196'Probe card assembly and kit'2008 7,347,702'Contact carriers (tiles) for populating larger substrates with spring contacts'2008 7,345,493'Wafer-level burn-in and test'2008 7,330,039'Method for making a socket to perform testing on integrated circuits'2008 7,291,910'Semiconductor chip assemblies, methods of making same and components for same'2007 7,271,481'Microelectronic component and assembly having leads with offset portions'2007 7,253,651'Remote test facility with wireless interface to local test facilities'2007 7,225,538'Resilient contact structures formed and then attached to a substrate'2007 7,218,127'Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component'2007 7,218,094'Wireless test system'2007 7,200,930'Probe for semiconductor devices'2007 7,202,677'Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component'2007 7,202,682'Composite motion probing'2007 7,202,687'Systems and methods for wireless semiconductor device testing'2007 7,198,969'Semiconductor chip assemblies, methods of making same and components for same'2007 7,196,531'Method of manufacturing a probe card'2007 7,168,162'Method of manufacturing a probe card'2007 7,142,000'Mounting spring elements on semiconductor devices, and wafer-level testing methodology'2006 7,140,883'Contact carriers (tiles) for populating larger substrates with spring contacts'2006 7,098,078'Microelectronic component and assembly having leads with offset portions'2006 7,086,149'Method of making a contact structure with a distinctly formed tip structure'2006 7,084,656'Probe for semiconductor devices'2006 7,082,682'Contact structures and methods for making same'2006 7,078,926'Wafer-level burn-in and test'2006 7,073,254'Method for mounting a plurality of spring contact elements'2006 7,064,566'Probe card assembly and kit'2006 7,063,541'Composite microelectronic spring structure and method for making same'2006 7,061,257'Probe card assembly'2006 7,059,047'Sockets for â€œspringedâ€ semiconductor devices'2006 7,024,763'Methods for making plated through holes usable as interconnection wire or probe attachments'2006 7,005,751'Layered microelectronic contact and method for fabricating same'2006 6,956,174'Tip structures'2005 6,940,093'Special contact points for accessing internal circuitry of an integrated circuit'2005 6,920,689'Method for making a socket to perform testing on integrated circuits'2005 6,913,468'Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods'2005 6,888,229'Connection components with frangible leads and bus'2005 6,864,105'Method of manufacturing a probe card'2005 6,840,374'Apparatus and method for cleaning test probes'2005 6,838,893'Probe card assembly'2005 6,836,962'Method and apparatus for shaping spring elements'2005 6,835,898'ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING THE CONTACT STRUCTURES TO ELECTRONIC COMPONENTS, AND APPLICATIONS FOR EMPLOYING THE CONTACT STRUCTURES'2004 6,825,052'Test assembly including a test die for testing a semiconductor product die'2004 6,825,422'Interconnection element with contact blade'2004 6,818,840'Method for manufacturing raised electrical contact pattern of controlled geometry'2004 6,807,734'Microelectronic contact structures, and methods of making same'2004 6,788,094'Wafer-level burn-in and test'2004 6,778,406'Resilient contact structures for interconnecting electronic devices'2004 6,759,311'Fan out of interconnect elements attached to semiconductor wafer'2004 6,741,085'Contact carriers (tiles) for populating larger substrates with spring contacts'2004 6,729,019'Method of manufacturing a probe card'2004 6,727,579'ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING THE CONTACT STRUCTURES TO ELECTRONIC COMPONENTS, AND APPLICATIONS FOR EMPLOYING THE CONTACT STRUCTURES'2004 6,727,580'Microelectronic spring contact elements'2004 6,701,612'Method and apparatus for shaping spring elements'2004 6,690,185'Large contactor with multiple, aligned contactor units'2004 6,669,489'Interposer, socket and assembly for socketing an electronic component and method of making and using same'2003 6,664,628'Electronic component overlapping dice of unsingulated semiconductor wafer'2003 6,655,023'Method and apparatus for burning-in semiconductor devices in wafer form'2003 6,642,625'Sockets for springed semiconductor devices'2003 6,624,648'Probe card assembly'2003 6,621,260'Special contact points for accessing internal circuitry of an integrated circuit'2003 6,615,485'Probe card assembly and kit, and methods of making same'2003 6,603,324'Special contact points for accessing internal circuitry of an integrated circuit'2003 6,597,187'Special contact points for accessing internal circuitry of an integrated circuit'2003 6,551,844'Test assembly including a test die for testing a semiconductor product die'2003 6,538,214'Method for manufacturing raised electrical contact pattern of controlled geometry'2003 6,534,856'Sockets for springed semiconductor devices'2003 6,525,555'Wafer-level burn-in and test'2003 6,520,778'Microelectronic contact structures, and methods of making same'2003 6,482,013'Microelectronic spring contact element and electronic component having a plurality of spring contact elements'2002 6,475,822'Method of making microelectronic contact structures'2002 6,476,333'Raised contact structures (solder columns)'2002 6,465,893'Stacked chip assembly'2002 6,456,099'Special contact points for accessing internal circuitry of an integrated circuit'2002 6,442,831'Method for shaping spring elements'2002 6,441,315'Contact structures with blades having a wiping motion'2002 6,433,419'Face-up semiconductor chip assemblies'2002 6,429,029'Concurrent design and subsequent partitioning of product and test die'2002 6,392,306'Semiconductor chip assembly with anisotropic conductive adhesive connections'2002 6,372,527'Methods of making semiconductor chip assemblies'2002 6,359,236'Mounting component with leads having polymeric strips'2002 6,336,269'Method of fabricating an interconnection element'2002 6,330,164'Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device'2001 6,307,161'Partially-overcoated elongate contact structures'2001 6,279,227'Method of forming a resilient contact structure'2001 6,272,744'Semiconductor connection components and methods with releasable lead support'2001 6,274,823'Interconnection substrates with resilient contact structures on both sides'2001 6,252,175'Electronic assembly comprising a substrate and a plurality of springable interconnection elements secured to terminals of the substrate'2001 6,246,247'Probe card assembly and kit, and methods of using same'2001 6,242,803'Semiconductor devices with integral contact structures'2001 6,232,149'Sockets for \"springed\" semiconductor devices'2001 6,215,670'Method for manufacturing raised electrical contact pattern of controlled geometry'2001 6,215,196'Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals'2001 6,184,587'Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components'2001 6,184,053'Method of making microelectronic spring contact elements'2001 6,168,974'Process of mounting spring contacts to semiconductor devices'2001 6,133,627'Semiconductor chip package with center contacts'2000 6,110,823'Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method'2000 6,064,213'Wafer-level burn-in and test'2000 6,054,756'Connection components with frangible leads and bus'2000 6,050,829'Making discrete power connections to a space transformer of a probe card assembly'2000 6,049,976'Method of mounting free-standing resilient electrical contact structures to electronic components'2000 6,043,563'Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals'2000 6,033,935'Sockets for \"springed\" semiconductor devices'2000 6,032,356'Wafer-level test and burn-in, and semiconductor process'2000 6,029,344'Composite interconnection element for microelectronic components, and method of making same'2000 6,023,103'Chip-scale carrier for semiconductor devices including mounted spring contacts'2000 5,998,228'Method of testing semiconductor'1999 5,998,864'Stacking semiconductor devices, particularly memory chips'1999 5,994,152'Fabricating interconnects and tips using sacrificial substrates'1999 5,983,493'Method of temporarily, then permanently, connecting to a semiconductor device'1999 5,974,662'Method of planarizing tips of probe elements of a probe card assembly'1999 5,977,618'Semiconductor connection components and methods with releasable lead support'1999 5,950,304'Methods of making semiconductor chip assemblies'1999 5,926,951'Method of stacking electronic components'1999 5,917,707'Flexible contact structure with an electrically conductive shell'1999 5,915,752'Method of making connections to a semiconductor chip assembly'1999 5,912,046'Method and apparatus for applying a layer of flowable coating material to a surface of an electronic component'1999 5,900,738'Contact structure device for interconnections, interposer, semiconductor assembly and package using the same and method'1999 5,897,326'Method of exercising semiconductor devices'1999 5,884,398'Mounting spring elements on semiconductor devices'1999 5,878,486'Method of burning-in semiconductor devices'1999 5,864,946'Method of making contact tip structures'1999 5,852,871'Method of making raised contacts on electronic components'1998 5,852,326'Face-up semiconductor chip assembly'1998 5,848,467'Methods of making semiconductor chip assemblies'1998 5,832,601'Method of making temporary connections between electronic components'1998 5,829,128'Method of mounting resilient contact structures to semiconductor devices'1998 5,820,014'Solder preforms'1998 5,806,181'Contact carriers (tiles) for populating larger substrates with spring contacts'1998 5,787,581'Methods of making semiconductor connection components with releasable load support'1998 5,772,451'Sockets for electronic components and methods of connecting to electronic components'1998 5,685,885'Wafer-scale techniques for fabrication of semiconductor chip assemblies'1997 5,682,061'Component for connecting a semiconductor chip to a substrate'1997 5,679,977'Semiconductor chip assemblies, methods of making same and components for same'1997 5,640,761'Method of making multi-layer circuit'1997 5,583,321'Multi-layer circuit construction methods and structures with customization features and components for use therein'1996 5,570,504'Multi-Layer circuit construction method and structure'1996 5,558,928'Multi-layer circuit structures, methods of making same and components for use therein'1996 5,536,909'Semiconductor connection components and methods with releasable lead support'1996 5,525,545'Semiconductor chip assemblies and components with pressure contact'1996 5,489,749'Semiconductor connection components and method with releasable lead support'1996 5,476,211'Method of manufacturing electrical contacts, using a sacrificial member'1995 5,414,298'Semiconductor chip assemblies and components with pressure contact'1995 5,390,844'Semiconductor inner lead bonding tool'1995 5,367,764'Method of making a multi-layer circuit assembly'1994 5,347,159'Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate'1994 5,346,861'Semiconductor chip assemblies and methods of making same'1994 5,282,312'Multi-layer circuit construction methods with customization features'1994 5,258,330'Semiconductor chip assemblies with fan-in leads'1993 5,198,189'Liquid metal matrix thermal paste'1993 5,192,618'Corrosion protection by FeMn by ion implantation'1993 5,173,256'Liquid metal matrix thermal paste'1992 5,148,265'Semiconductor chip assemblies with fan-in leads'1992 5,148,266'Semiconductor chip assemblies having interposer and flexible lead'1992 5,134,038'Thin film magnetic recording medium with controlled grain morphology and topology'1992 5,086,558'Direct attachment of semiconductor chips to a substrate with a substrate with a thermoplastic interposer'1992 5,062,896'Solder/polymer composite paste and method'1991 4,536,232'Erosion and corrosion resistant cast iron alloy containing chromium, nickel and molybdenum'1985 4,424,853'Foundry practices'1984 4,377,196'Method of centrifugally casting a metal tube'1983 4,357,394'Centrifugal casting'1982

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1982–1985Patents assigned to ABEX CORP (4)· patent assignee history

1982–1985Based in Hoboken, NJ, US· patent location history

1991–1993Patents assigned to IBM (6)· patent assignee history

1991–2006Based in Peekskill, NY, US· patent location history

1993–2007Patents assigned to TESSERA INC (36)· patent assignee history

1995–2015Patents assigned to FORMFACTOR INC (140)· patent assignee history

1995–2001Based in Peekskil, NY, US· patent location history

1998–2020Based in Orinda, CA, US· patent location history

1999–2005Based in Livermore, CA, US· patent location history

2012–2016Patents assigned to KHANDROS IGOR Y (7)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
FORMFACTOR INC	140	1995–2015
TESSERA INC	36	1993–2007
KHANDROS IGOR Yself	7	2012–2016
IBM	6	1991–1993
ABEX CORP	4	1982–1985

Locations

Location	Patents	Span
Orinda, California, US	140	1998–2020
Peekskill, New York, US	45	1991–2006
Livermore, California, US	5	1999–2005
Hoboken, New Jersey, US	4	1982–1985
Peekskil, New York, US	2	1995–2001