Inventor
Ping-Chia Shih
Inventor
Tainan, TW
Overview
Patents· 35 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices31%
H10BElectronic memory devices27%
H01LSemiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
G11CStatic stores2%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
PatentTitleYear
10,720,440Method for fabricating semiconductor structure202010,580,780Semiconductor structure and method of forming the same202010,340,282Semiconductor memory device and fabrication method thereof201910,312,250Semiconductor device and manufacturing method thereof201910,199,385Non-volatile memory device with reduced distance between control gate electrode and selecting gate electrode and manufacturing method thereof201910,177,165Method for fabricating merging semiconductor integrated circuit201910,008,615Semiconductor device and manufacturing method thereof20189,966,382Semiconductor structure and method for fabricating the same20189,466,497'Method for fabricating a silicon-oxide-nitride-oxide-silicon (SONOS) non-volatile memory cell'20169,412,851'Method for fabricating semiconductor device including a patterned multi-layered dielectric film with an exposed edge'20169,397,202'Method for fabricating semiconductor device'20169,331,183'Semiconductor device and fabrication method thereof'20169,330,923'Non-volatile memory and method of manufacturing the same'20169,202,701'Method for manufacturing silicon—oxide—nitride—oxide—silicon (SONOS) non-volatile memory cell'20159,129,852'Method for fabricating non-volatile memory semiconductor device'20159,040,423'Method for manufacturing semiconductor device'20158,921,185'Method for fabricating integrated circuit with different gate heights and different materials'20148,792,275'Non-volatile static random access memory (NVSRAM) device'20148,742,549'Shallow trench isolation structure'20148,722,488'Method of fabricating semiconductor device'20148,633,079'Method for fabricating a SONOS memory'20148,629,025'Semiconductor device and method for fabricating semiconductor device'20148,575,683'Semiconductor device and method of fabricating the same'20138,546,226'SONOS non-volatile memory cell and fabricating method thereof'20138,546,871'Non-volatile memory cell and fabricating method thereof'20138,383,480'Method for forming semiconductor structure and method for forming memory using the same'20138,314,501'Semiconductor chip package structure, semiconductor chip and semiconductor chip group'20128,222,112'Method for manufacturing NAND memory cells'20128,119,489'Method of forming a shallow trench isolation structure having a polysilicon capping layer'20128,093,153'Method of etching oxide layer and nitride layer'20128,034,690'Method of etching oxide layer and nitride layer'20118,018,768'Non-volatile static random access memory (NVSRAM) device'20117,973,353'NAND memory cells'20117,368,782'Dual-bit non-volatile memory cell and method of making the same'20087,071,063'Dual-bit non-volatile memory cell and method of making the same'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2020Patents assigned to UNITED MICROELECTRONICS CORP (35)· patent assignee history
2006–2014Based in Hsinchu, TW· patent location history
2012–2014Patents assigned to SHIH PING-CHIA (13)· patent assignee history
2012–2014Patents assigned to HUANG CHI-CHENG (5)· patent assignee history
2012–2020Based in Tainan, TW· patent location history
2013–2014Patents assigned to LEE HSIANG-CHEN (4)· patent assignee history
2013–2014Patents assigned to WANG CHIH-MING (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED MICROELECTRONICS CORP | 35 | 2006–2020 |
| SHIH PING-CHIAself | 13 | 2012–2014 |
| HUANG CHI-CHENG | 5 | 2012–2014 |
| LEE HSIANG-CHEN | 4 | 2013–2014 |
| WANG CHIH-MING | 4 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tainan, TW | 24 | 2012–2020 |
| Hsinchu, TW | 11 | 2006–2014 |