LexDanaLexDanabeta
Inventor

Tadashi Maeda

Inventor
Tokyo, JP

Overview

34→
Patents
1992–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 34 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
H05KPrinted circuits10%
Y02PClimate change mitigation technologies in the production or processing of goods8%
H01LSemiconductor devices7%
H03KPulse technique7%
B23KSoldering or unsoldering6%
Y10TTechnical subjects covered by former us classification6%
H04BTransmission4%
H10DInorganic electric semiconductor devices4%
H03FAmplifiers3%
PatentTitleYear
10,168,059Filtering medium and air purifier201910,115,684Semiconductor device20189,999,123Connection structure of circuit member, connection method, and connection material20189,589,887'Semiconductor device'20179,466,591'Semiconductor device'20169,439,335'Electronic component mounting line and electronic component mounting method'20169,252,200'Semiconductor device'20169,125,329'Electronic component mounting line and electronic component mounting method'20159,030,064'Totally-enclosed fan-cooled motor'20158,960,526'Flux for soldering and soldering process'20158,673,685'Electronic component mounting line and electronic component mounting method'20148,446,179'Start signal detector circuit'20138,248,104'Phase comparator and phase-locked loop'20128,083,121'Paste for soldering and soldering method using the same'20118,015,328'Information storage device, information processing system, and setting method of data transfer mode of information processing device'20117,873,139'Signal processing device'20117,828,898'CVD apparatus of improved in-plane uniformity'20107,821,334'Amplification circuit'20107,816,823'Cooling device of electric motor for vehicle'20107,663,394'Start signal detector circuit'20107,632,710'Method for soldering electronic component and soldering structure of electronic component'20097,568,610'Method of soldering electronic component having solder bumps to substrate'20097,298,215'Amplifying circuit'20077,180,375'PLL circuit'20076,797,544'Semiconductor device, method of manufacturing the device and method of mounting the device'20046,429,717'Receiving circuit'20026,194,841'Discharge lamp lighting device'20016,189,771'Method of forming solder bump and method of mounting the same'20016,137,350'Differential amplifier circuit'20005,909,128'FETs logic circuit'19995,696,453'GaAs logic circuit with temperature compensation circuitry'19975,619,146'Switching speed fluctuation detecting apparatus for logic circuit arrangement'1997RE035227'Process and apparatus for analyzing cells'19965,088,816'Process and apparatus for analyzing cells'1992

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1992–1996Based in Kobe, JP· patent location history
1997–2013Patents assigned to NEC CORP (11)· patent assignee history
1997–2018Based in Tokyo, JP· patent location history
2001–2011Based in Fukuoka, JP· patent location history
2009–2016Patents assigned to PANASONIC CORP (6)· patent assignee history
2011–2018Patents assigned to RENESAS ELECTRONICS CORP (6)· patent assignee history
2011–2015Patents assigned to MAEDA TADASHI (5)· patent assignee history
2014–2016Based in Yamanashi, JP· patent location history
2015–2019Patents assigned to PANASONIC IP MAN CO LTD (5)· patent assignee history
2018–2019Based in Osaka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NEC CORP111997–2013
PANASONIC CORP62009–2016
RENESAS ELECTRONICS CORP62011–2018
MAEDA TADASHIself52011–2015
PANASONIC IP MAN CO LTD52015–2019
Locations
LocationPatentsSpan
Tokyo, JP171997–2018
Fukuoka, JP42001–2011
Yamanashi, JP32014–2016
Osaka, JP22018–2019
Kobe, JP21992–1996