Inventor
Hiroshi Mikino
Inventor
Tachikawa, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1044%
B23KSoldering or unsoldering33%
C22CAlloys11%
Y10TTechnical subjects covered by former us classification11%
PatentTitleYear
5,031,821'Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method'19914,845,543'Semiconductor device and method of manufacturing the same'19894,123,293'Method of providing semiconductor pellet with heat sink'19784,100,566'Resin-sealed type semiconductor devices and manufacturing method of the same'1978Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1978–1991Patents assigned to HITACHI LTD (4)· patent assignee history
1978–1991Based in Tachikawa, JP· patent location history
1991Patents assigned to HITACHI MICROCUMPUTER ENG (1)· patent assignee history
1991Patents assigned to HITACHI TOKYO ELECTRONICS (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 4 | 1978–1991 |
| HITACHI MICROCUMPUTER ENG | 1 | 1991 |
| HITACHI TOKYO ELECTRONICS | 1 | 1991 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tachikawa, JP | 4 | 1978–1991 |