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Inventor

Chia-Jung Tu

Inventor
Hsinchu County, TW

Overview

9→
Patents
2013–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 9 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1058%
H01LSemiconductor devices17%
H05KPrinted circuits17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
PatentTitleYear
9,961,759Flexible substrate20189,929,051'Wafer dicing method'20189,510,441'Flexible substrate'20169,159,660'Semiconductor package structure and method for making the same'20158,704,345'Semiconductor package and lead frame thereof'20148,658,466'Semiconductor package structure and method for making the same'20148,581,384'Semiconductor package structure'20138,497,571'Thin flip chip package structure'20138,471,372'Thin flip chip package structure'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2018Patents assigned to CHIPBOND TECHNOLOGY CORP (7)· patent assignee history
2013–2014Patents assigned to HSIEH CHIN-TANG (5)· patent assignee history
2013–2014Patents assigned to TU CHIA-JUNG (5)· patent assignee history
2013–2014Patents assigned to CHANG SHIH-CHIEH (3)· patent assignee history
2013–2014Patents assigned to HO LUNG-HUA (3)· patent assignee history
2013–2016Based in Hsinchu County, TW· patent location history
2014–2018Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHIPBOND TECHNOLOGY CORP72013–2018
HSIEH CHIN-TANG52013–2014
TU CHIA-JUNGself52013–2014
CHANG SHIH-CHIEH32013–2014
HO LUNG-HUA32013–2014
Locations
LocationPatentsSpan
Hsinchu County, TW62013–2016
Hsinchu, TW32014–2018