Inventor
Kun-dae Yeom
Inventor
Cheonan-si, KR
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1052%
H01LSemiconductor devices24%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
H05KPrinted circuits5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
Y10TTechnical subjects covered by former us classification5%
PatentTitleYear
10,607,905Package substrate for a semiconductor package having landing pads extending toward a through-hole in a chip mounting region202010,361,135Semiconductor package including landing pads extending at an oblique angle toward a through-hole in the package substrate20199,455,217'Semiconductor package including multiple chips and separate groups of leads'20169,041,181'Land grid array package capable of decreasing a height difference between a land and a solder resist'20158,901,750'Semiconductor package including multiple chips and separate groups of leads'20148,723,333'Semiconductor package including multiple chips and separate groups of leads'20148,664,757'High density chip stacked package, package-on-package and method of fabricating the same'20148,193,626'Semiconductor package including multiple chips and separate groups of leads'20127,759,795'Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same'20107,521,289'Package having dummy package substrate and method of fabricating the same'20097,391,105'Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (11)· patent assignee history
2008–2016Based in Cheonan-si, KR· patent location history
2010Based in Chungcheongnam-do, KR· patent location history
2012–2015Patents assigned to YEOM KUN-DAE (4)· patent assignee history
2012–2014Patents assigned to KIM HYEONG-SEOB (2)· patent assignee history
2012–2014Patents assigned to LIM GWANG-MAN (2)· patent assignee history
2012–2014Patents assigned to PARK CHUL (2)· patent assignee history
2019–2020Based in Asan-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 11 | 2008–2020 |
| YEOM KUN-DAEself | 4 | 2012–2015 |
| KIM HYEONG-SEOB | 2 | 2012–2014 |
| LIM GWANG-MAN | 2 | 2012–2014 |
| PARK CHUL | 2 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cheonan-si, KR | 8 | 2008–2016 |
| Asan-si, KR | 2 | 2019–2020 |
| Chungcheongnam-do, KR | 1 | 2010 |