Inventor
Ken Yoshioka
Inventor
Hikari, JP
Overview
Patents· 78 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
H01JElectric discharge tubes or discharge lamps23%
Y10TTechnical subjects covered by former us classification12%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
C23CCoating metallic material4%
E03CDomestic plumbing installations for fresh water or waste water2%
H01LSemiconductor devices2%
H05HPlasma technique2%
B60JWindows, windscreens, non-fixed roofs, doors, or similar devices for vehicles1%
PatentTitleYear
11,065,985Vehicle seat device20219,378,929'Plasma processing apparatus and plasma processing method'20169,039,865'Plasma processing apparatus'20159,017,786'Method and apparatus for repairing an electrostatic chuck device, and the electrostatic chuck device'20158,951,385'Plasma processing apparatus and plasma processing method'20158,940,128'Plasma processing apparatus'20158,795,467'Plasma processing apparatus and method'20148,282,848'Plasma processing method and plasma processing apparatus'20128,252,132'Method and apparatus for repairing an electrostatic chuck device, and the electrostatic chuck device'20128,231,759'Plasma processing apparatus'20128,092,637'Manufacturing method in plasma processing apparatus'20128,083,889'Apparatus and method for plasma etching'20118,062,473'Plasma processing apparatus and method'20117,833,429'Plasma processing method'20107,744,721'Plasma processing apparatus'20107,740,739'Plasma processing apparatus and method'20107,713,756'Apparatus and method for plasma etching'20107,608,162'Plasma processing apparatus and method'20097,347,656'Vacuum processing apparatus and semiconductor manufacturing line using the same'20087,288,166'Plasma processing apparatus'2007RE039895'Semiconductor integrated circuit arrangement fabrication method'20077,224,568'Plasma processing method and plasma processing apparatus'20077,201,551'Vacuum processing apparatus and semiconductor manufacturing line using the same'20077,183,715'Method for operating a semiconductor processing apparatus'20077,138,606'Wafer processing method'20067,049,243'Surface processing method of a specimen and surface processing apparatus of the specimen'20066,962,472'Vacuum processing apparatus and semiconductor manufacturing line using the same'20056,895,685'Vacuum processing apparatus and semiconductor manufacturing line using the same'20056,895,179'Wafer stage for wafer processing apparatus'20056,867,144'Apparatus and method for plasma processing high-speed semiconductor circuits with increased yield'20056,850,012'Plasma processing apparatus'20056,846,363'Plasma processing apparatus and method'20056,837,005'Weatherstrip for automobile'20056,835,665'Etching method of hardly-etched material and semiconductor fabricating method and apparatus using the method'20046,833,051'Plasma processing apparatus and method'20046,825,617'Semiconductor processing apparatus'20046,759,338'Plasma processing apparatus and method'20046,756,737'Plasma processing apparatus and method'20046,752,580'Vacuum processing apparatus and semiconductor manufacturing line using the same'20046,752,579'Vacuum processing apparatus and semiconductor manufacturing line using the same'20046,705,828'Vacuum processing apparatus and semiconductor manufacturing line using the same'20046,677,244'Specimen surface processing method'20046,672,819'Vacuum processing apparatus and semiconductor manufacturing line using the same'20046,649,021'Apparatus and method for plasma processing high-speed semiconductor circuits with increased yield'20036,646,233'Wafer stage for wafer processing apparatus and wafer processing method'20036,596,551'Etching end point judging method, etching end point judging device, and insulating film etching method using these methods'20036,549,393'Semiconductor wafer processing apparatus and method'20036,526,330'Vacuum processing apparatus and semiconductor manufacturing line using the same'20036,519,504'Vacuum processing apparatus and semiconductor manufacturing line using the same'20036,499,424'Plasma processing apparatus and method'20026,491,832'Method for processing specimens'20026,492,277'Specimen surface processing method and apparatus'20026,481,370'Plasma processsing apparatus'20026,430,878'Glass guide'20026,430,469'Vacuum processing apparatus and semiconductor manufacturing line using the same'20026,413,876'Method for plasma processing high-speed semiconductor circuits with increased yield'20026,388,382'Plasma processing apparatus and method'20026,373,681'Electrostatic chuck, and method of and apparatus for processing sample using the chuck'20026,329,050'Adhesive for electronic parts and adhesive tape for electronic parts'20016,309,980'Semiconductor integrated circuit arrangement fabrication method'20016,253,117'Vacuum processing apparatus and semiconductor manufacturing line using the same'20016,245,202'Plasma treatment device'20016,243,251'Electrostatic chuck, and method of and apparatus for processing sample using the chuck'20016,188,935'Vacuum processing apparatus and semiconductor manufacturing line using the same'20016,187,874'Adhesive for electronic parts and adhesive tape for electronic parts'20016,180,019'Plasma processing apparatus and method'20016,172,321'Method and apparatus for plasma processing apparatus'20016,074,958'Semiconductor integrated circuit arrangement fabrication method'20006,034,346'Method and apparatus for plasma processing apparatus'20005,962,347'Semiconductor integrated circuit arrangement fabrication method'19995,946,184'Electrostatic chuck, and method of and apparatus for processing sample'19995,874,013'Semiconductor integrated circuit arrangement fabrication method'19995,855,726'Vacuum processing apparatus and semiconductor manufacturing line using the same'19995,502,613'Superconducting magnet abnormality detection and protection apparatus'19965,424,702'Superconducting magnet'19955,363,829'Ignition distributor of internal combustion engine'19945,343,180'Coil structure and coil container'19945,283,031'Process for producing precision metal part by powder molding wherein the hydrogen reduction loss is controlled'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–2009Patents assigned to HITACHI LTD (47)· patent assignee history
1994–1996Based in Hitachiota, JP· patent location history
1999–2016Based in Hikari, JP· patent location history
1999–2001Based in Kudamatsu, JP· patent location history
2001–2015Based in Shizuoka, JP· patent location history
2003–2016Patents assigned to HITACHI HIGH TECH CORP (22)· patent assignee history
2011–2015Patents assigned to YOSHIOKA KEN (10)· patent assignee history
2011–2015Patents assigned to NISHIO RYOJI (5)· patent assignee history
2011–2012Patents assigned to EDAMURA MANABU (2)· patent assignee history
2021Based in Hiroshima, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 47 | 1994–2009 |
| HITACHI HIGH TECH CORP | 22 | 2003–2016 |
| YOSHIOKA KENself | 10 | 2011–2015 |
| NISHIO RYOJI | 5 | 2011–2015 |
| EDAMURA MANABU | 2 | 2011–2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hikari, JP | 60 | 1999–2016 |
| Shizuoka, JP | 5 | 2001–2015 |
| Kudamatsu, JP | 5 | 1999–2001 |
| Hitachiota, JP | 2 | 1994–1996 |
| Hiroshima, JP | 1 | 2021 |