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Inventor

Hui-Ying Hsieh

Inventor
Kaohsiung, TW

Overview

6→
Patents
2013–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 6 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H01LSemiconductor devices42%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
PatentTitleYear
11,037,868Semiconductor device package and method of manufacturing the same202110,707,157Semiconductor device package202010,615,105Semiconductor device package and method of manufacturing the same202010,083,888Semiconductor device package20188,889,488'Method for manufacturing semiconductor package'20148,546,950'Semiconductor package and manufacturing method thereof'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2021Patents assigned to ADVANCED SEMICONDUCTOR ENG (6)· patent assignee history
2013Patents assigned to CHAO SHIN-HUA (1)· patent assignee history
2013Patents assigned to CHUNG CHIH-MING (1)· patent assignee history
2013Patents assigned to HSIEH HUI-YING (1)· patent assignee history
2013Patents assigned to LIU CHAO-YUAN (1)· patent assignee history
2013Based in Yanchao Township, TW· patent location history
2014–2021Based in Kaohsiung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ADVANCED SEMICONDUCTOR ENG62013–2021
CHAO SHIN-HUA12013
CHUNG CHIH-MING12013
HSIEH HUI-YINGself12013
LIU CHAO-YUAN12013
Locations
LocationPatentsSpan
Kaohsiung, TW52014–2021
Yanchao Township, TW12013