Inventor
Satoru Fukunaga
Inventor
Tenri, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
B24BMachines, devices, or processes for grinding or polishing18%
G01RMeasuring electric variables18%
B25BTools or bench devices not otherwise provided for, for fastening, connecting, disengaging, or holding9%
H05KPrinted circuits9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%
PatentTitleYear
6,984,586'Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers'20066,520,844'Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers'20036,423,102'Jig used for assembling semiconductor devices'20025,412,314'Testing apparatus for semiconductor device formed on tape carrier'19955,247,248'Burn-in apparatus and method of use thereof'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2006Patents assigned to SHARP KK (5)· patent assignee history
1993–2002Based in Tenri, JP· patent location history
2003–2006Based in Osaka, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHARP KK | 5 | 1993–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tenri, JP | 3 | 1993–2002 |
| Osaka, JP | 2 | 2003–2006 |