Inventor

BIN-SIANG TSAI

Inventor
TW

Overview

54→
Patents
2021–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 54 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices21%
H10NElectric solid-state devices not otherwise provided for20%
H10BElectronic memory devices19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
H10DInorganic electric semiconductor devices11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
G11CStatic stores4%
H01FMagnets3%
B82YSpecific uses or applications of nanostructures1%
C23CCoating metallic material1%
PatentTitleYear
12,598,998Interposer having inductor coil pattern embedded in buffer layer and fabrication thereof202612,563,800Method for forming ohmic contacts on compound semiconductor devices202612,557,557Method for fabricating magnetoresistive random access memory (MRAM) device202612,538,540Semiconductor device and manufacturing method thereof202612,532,485MIM capacitor and fabricating method of the same202612,527,230Magnetoresistive random access memory device202612,501,678Semiconductor device and method for manufacturing the same202512,471,498Semiconductor device and method for fabricating the same202512,432,946MIM capacitor structure and fabricating method of the same202512,432,995Compound semiconductor device and fabrication method thereof202512,419,070Semiconductor device including III-V compound semiconductor layer and manufacturing method thereof202512,406,973Structure with photodiode, high electron mobility transistor, surface acoustic wave device and fabricating method of the same202512,389,606MRAM structure and fabricating method of the same202512,376,323Semiconductor structure and the forming method thereof202512,329,037Method for fabricating semiconductor device202512,300,633Warpage-reducing semiconductor structure and fabricating method of the same202512,293,941Gallium nitride device with field plate structure and method of manufacturing the same202512,207,475Semiconductor device and method for fabricating the same202512,205,909Semiconductor device and method for fabricating the same202512,127,413Magnetoresistive random access memory and method for fabricating the same202412,127,414Semiconductor device and method for fabricating the same202412,120,962Method for fabricating semiconductor device202412,108,681Semiconductor device and method for fabricating the same202412,108,691Manufacturing method of memory device202412,089,512Semiconductor structure202412,069,960Magnetic random access memory structure202412,015,076HEMT and method of fabricating the same202412,016,250MRAM structure and method of fabricating the same202412,014,995Warpage-reducing semiconductor structure and fabricating method of the same202411,871,677Method for fabricating semiconductor device202411,849,649Method for fabricating memory cell of magnetoresistive random access memory202311,818,960Semiconductor device and method for fabricating the same202311,810,818Metal interconnect structure and method for fabricating the same202311,793,091Semiconductor structure and manufacturing method thereof202311,778,922Semiconductor device and method for fabricating the same202311,762,293Fabricating method of reducing photoresist footing202311,737,370Magnetoresistive random access memory (MRAM) device202311,723,215Semiconductor device and method for fabricating the same202311,723,287Method of manufacturing magnetic tunnel junction (MTJ) device202311,707,003Memory device and manufacturing method thereof202311,706,993Method of manufacturing magnetoresistive random access memory (MRAM) device202311,688,790HEMT and method of fabricating the same202311,688,802High electron mobility transistor and fabrication method thereof202311,676,920Semiconductor device and method for fabricating the same202311,632,889Method of forming memory cell202311,621,296Magnetoresistive random access memory and method for fabricating the same202311,605,777MRAM structure and method of fabricating the same202311,521,895Semiconductor device202211,495,737Magnetic tunnel junction (MTJ) device202211,462,513Chip bonding alignment structure, chip bonding structure and methods for fabricating the same202211,462,441Method for fabricating semiconductor device202211,373,901Interconnection structure and method of forming the same202211,258,005Magnetoresistive random access memory device and method for fabricating the same202211,189,793Method of forming resistive random access memory cell2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to UNITED MICROELECTRONICS CORP (54)· patent assignee history
2021–2026Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
UNITED MICROELECTRONICS CORP542021–2026
Locations
LocationPatentsSpan
TW542021–2026