Inventor
Rajashree Baskaran
Inventor
Seattle, WA, US
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H10DInorganic electric semiconductor devices16%
H01LSemiconductor devices11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
B81BMicrostructural devices or systems, e.g. micromechanical devices5%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers5%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems4%
A61BDiagnosis3%
A61FFilters implantable into blood vessels3%
B23KSoldering or unsoldering3%
PatentTitleYear
10,827,261Apparatus and methods for bone conduction context detection202010,462,578Piezoelectric contact microphone with mechanical interface201910,455,324Apparatus and methods for bone conduction context detection201910,236,282Partial layer transfer system and method201910,099,307Interconnect alloy material and methods20189,850,121Backside bulk silicon MEMS20179,835,648Liquid metal interconnects20179,818,751'Methods of forming buried vertical capacitors and structures formed thereby'20179,731,369'Interconnect alloy material and methods'20179,720,496'Techniques for stabilizing a display scene output'20179,646,972'Methods of forming buried vertical capacitors and structures formed thereby'20179,513,311'Inertial sensor pendulum test apparatus'20169,508,675'Microelectronic package having direct contact heat spreader and method of manufacturing same'20169,503,829'Ear pressure sensors integrated with speakers for smart sound level exposure'20169,400,557'Multimodal haptic effect system'20169,294,035'Multigate resonant channel transistor'20169,196,752'Backside bulk silicon MEMS'20159,061,890'Methods of forming buried electromechanical structures coupled with device substrates and structures formed thereby'20158,541,876'Microelectronic package having direct contact heat spreader and method of manufacturing same'20137,902,617'Forming a thin film electric cooler and structures formed thereby'20117,875,934'Semiconductor substrate with islands of diamond and resulting devices'20117,833,816'Forming a thin film thermoelectric cooler and structures formed thereby'20107,821,073'Patterned backside stress engineering for transistor performance optimization'20107,723,759'Stacked wafer or die packaging with enhanced thermal and device performance'20107,666,714'Assembly of thin die coreless package'20107,557,438'Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same'20097,517,228'Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuit'20097,476,568'Wafer-level assembly of heat spreaders for dual IHS packages'20097,449,361'Semiconductor substrate with islands of diamond and resulting devices'20087,371,630'Patterned backside stress engineering for transistor performance optimization'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2020Patents assigned to INTEL CORP (30)· patent assignee history
2008–2016Based in Phoenix, AZ, US· patent location history
2010–2019Based in Seattle, WA, US· patent location history
2010–2011Based in Chandler, AZ, US· patent location history
2013–2017Patents assigned to BASKARAN RAJASHREE (5)· patent assignee history
2013–2016Patents assigned to DUBIN VALERY M (2)· patent assignee history
2013–2016Patents assigned to HU CHUAN (2)· patent assignee history
2017Patents assigned to JUN KIMIN (2)· patent assignee history
2017–2020Based in Portland, OR, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 30 | 2008–2020 |
| BASKARAN RAJASHREEself | 5 | 2013–2017 |
| DUBIN VALERY M | 2 | 2013–2016 |
| HU CHUAN | 2 | 2013–2016 |
| JUN KIMIN | 2 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seattle, Washington, US | 12 | 2010–2019 |
| Phoenix, AZ, US | 9 | 2008–2016 |
| Portland, OR, US | 6 | 2017–2020 |
| Chandler, AZ, US | 3 | 2010–2011 |