Inventor
Seishiro Yamakawa
Inventor
Hirakata, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits40%
C03CChemical composition of glasses, glazes or vitreous enamels30%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients10%
C08LCompositions of macromolecular compounds10%
Y10TTechnical subjects covered by former us classification10%
PatentTitleYear
5,407,872'Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material'19955,334,645'Substrate for circuit board including the glass fibers as reinforcing material'19945,284,807'Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material'19945,275,878'Composite dielectric and printed-circuit use substrate utilizing the same'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–1995Patents assigned to MATSUSHITA ELECTRIC WORKS LTD (4)· patent assignee history
1994–1995Patents assigned to NIPPON ELECTRIC GLASS CO (3)· patent assignee history
1994Patents assigned to SAKAI CHEMICAL INDUSTRY CO (1)· patent assignee history
1994–1995Based in Hirakata, JP· patent location history
1994Based in Kadoma, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MATSUSHITA ELECTRIC WORKS LTD | 4 | 1994–1995 |
| NIPPON ELECTRIC GLASS CO | 3 | 1994–1995 |
| SAKAI CHEMICAL INDUSTRY CO | 1 | 1994 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hirakata, JP | 3 | 1994–1995 |
| Kadoma, JP | 1 | 1994 |