Inventor
Hiroji Aga
Inventor
Takasaki, JP
Overview
Patents· 44 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1032%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H01LSemiconductor devices13%
H10DInorganic electric semiconductor devices11%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%
B82YSpecific uses or applications of nanostructures1%
G01BMeasuring length, thickness or similar linear dimensions1%
G02BOptical elements, systems or apparatus1%
PatentTitleYear
10,490,440Method for manufacturing bonded SOI wafer201910,204,824Method for producing SOI wafer201910,115,580Method for manufacturing an SOI wafer20189,953,860Method of manufacturing SOI wafer20189,865,497'Method for manufacturing bonded wafer'20189,859,149'Method of producing bonded wafer with uniform thickness distribution'20189,793,154'Method for manufacturing bonded SOI wafer'20179,773,694'Method for manufacturing bonded wafer'20179,679,800'Method for manufacturing bonded wafer'20179,673,085'Method for manufacturing SOI wafer'20179,378,999'Method for manufacturing SOI wafer'20169,337,080'Method for manufacturing SOI wafer'20169,240,344'Method for manufacturing SOI wafer'20169,093,497'Method for manufacturing bonded SOI wafer'20159,076,840'Method for manufacturing a bonded SOI wafer'20159,029,240'Method for manufacturing SOI wafer'20158,987,109'Method for manufacturing bonded wafer and bonded SOI wafer'20158,962,352'Method for calculating warpage of bonded SOI wafer and method for manufacturing bonded SOI wafer'20158,728,912'Method for manufacturing SOI wafer'20148,691,665'Method for producing bonded wafer'20148,202,787'Method for manufacturing SOI wafer'20128,173,521'Method for manufacturing bonded wafer'20128,097,523'Method for manufacturing bonded wafer'20127,959,731'Method for producing semiconductor wafer'20117,902,042'Method of manufacturing SOI wafer and thus-manufactured SOI wafer'20117,560,313'SOI wafer and method for producing the same'20097,524,744'Method of producing SOI wafer and SOI wafer'20097,521,334'Method for producing direct bonded wafer and direct bonded wafer'20097,320,929'Method of fabricating SOI wafer'20087,288,418'Process for treating substrates for the microelectronics industry, and substrates obtained by this process'20077,176,102'Method for producing SOI wafer and SOI wafer'20077,029,993'Method for treating substrates for microelectronics and substrates obtained according to said method'20066,998,329'SOI wafer producing method, and wafer separating jig'20066,897,124'Method of manufacturing a bonded wafers using a Bernoulli chuck'20056,884,696'Method for producing bonding wafer'20056,846,718'Method for producing SOI wafer and SOI wafer'20056,380,551'Optical function device with photonic band gap and/or filtering characteristics'20026,372,609'Method of Fabricating SOI wafer by hydrogen ION delamination method and SOI wafer fabricated by the method'20026,362,076'Method of fabricating an SOI wafer by hydrogen ion delamination without independent bonding heat treatment'20026,284,628'Method of recycling a delaminated wafer and a silicon wafer used for the recycling'20016,239,004'Method of forming oxide film on an SOI layer and method of fabricating a bonded wafer'20016,238,990'Method for heat treatment of SOI wafer and SOI wafer heat-treated by the method'20016,140,210'Method of fabricating an SOI wafer and SOI wafer fabricated thereby'20005,998,281'SOI wafer and method for the preparation thereof'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2019Patents assigned to SHINETSU HANDOTAI KK (42)· patent assignee history
1999–2011Based in Gunma, JP· patent location history
2002–2015Based in Annaka, JP· patent location history
2006–2007Based in Annaka-shi, JP· patent location history
2012–2015Patents assigned to AGA HIROJI (7)· patent assignee history
2012–2015Patents assigned to NOTO NOBUHIKO (5)· patent assignee history
2012Patents assigned to KOBAYASHI NORIHIRO (3)· patent assignee history
2014–2015Patents assigned to YOKOKAWA ISAO (3)· patent assignee history
2015–2019Based in Takasaki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINETSU HANDOTAI KK | 42 | 1999–2019 |
| AGA HIROJIself | 7 | 2012–2015 |
| NOTO NOBUHIKO | 5 | 2012–2015 |
| KOBAYASHI NORIHIRO | 3 | 2012 |
| YOKOKAWA ISAO | 3 | 2014–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Takasaki, JP | 16 | 2015–2019 |
| Annaka, JP | 13 | 2002–2015 |
| Gunma, JP | 13 | 1999–2011 |
| Annaka-shi, JP | 2 | 2006–2007 |