Inventor
Ao GUO
Inventor
CN
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing20%
H04LTransmission of digital information, e.g. telegraphic communication20%
H04WWireless communication networks20%
G01VGeophysics5%
G01WMeteorology5%
G11CStatic stores5%
H10BElectronic memory devices5%
H10DInorganic electric semiconductor devices5%
H10NElectric solid-state devices not otherwise provided for5%
Y02ATechnologies for adaptation to climate change5%
PatentTitleYear
12,501,627RRAM cell structure and fabrication method therefor202512,375,430Method and device to decompress data packets202512,309,243Communication method and apparatus202512,127,039Method for reporting UDC information by UE, and device202411,997,553Cell camping method and device202411,880,014Prediction method and system for changes of physical parameters after earthquakes202411,640,324Intelligent cloud management based on profile202311,513,918Action undo service based on cloud platform202211,354,166Intelligent assistant for cloud management2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2023Patents assigned to MICROSOFT TECHNOLOGY LICENSING LLC (3)· patent assignee history
2022–2023Based in US· patent location history
2024–2025Patents assigned to HUAWEI TECH CO LTD (4)· patent assignee history
2024Patents assigned to UNIV SHANDONG (1)· patent assignee history
2024–2025Based in CN· patent location history
2025Patents assigned to SHANGHAI IC R&D CT CO LTD (1)· patent assignee history
2025Patents assigned to SHANGHAI INTEGRATED CIRCUIT EQUIPMENT & MAT INDUSTRY INNOVATION CENTER CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HUAWEI TECH CO LTD | 4 | 2024–2025 |
| MICROSOFT TECHNOLOGY LICENSING LLC | 3 | 2022–2023 |
| SHANGHAI IC R&D CT CO LTD | 1 | 2025 |
| SHANGHAI INTEGRATED CIRCUIT EQUIPMENT & MAT INDUSTRY INNOVATION CENTER CO LTD | 1 | 2025 |
| UNIV SHANDONG | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 6 | 2024–2025 |
| US | 3 | 2022–2023 |