Inventor
Ismail C. Noyan
Inventor
Peekskill, NY, US
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H05KPrinted circuits21%
Y10TTechnical subjects covered by former us classification16%
B23KSoldering or unsoldering8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application3%
G02BOptical elements, systems or apparatus3%
H10DInorganic electric semiconductor devices3%
Y02PClimate change mitigation technologies in the production or processing of goods3%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
PatentTitleYear
7,214,548'Apparatus and method for flattening a warped substrate'20076,734,363'Lightweight electronic equipment conductor with coolant permeable support'20046,503,641'Interconnects with Ti-containing liners'20036,211,042'Growth of epitaxial semiconductor films in presence of reactive metal'20016,029,199'Computing system having a system supervisor and a collection of computing subunits each of which has a subunit supervisor'20006,017,401'Conductivity improvement in thin films of refractory metal'20005,915,462'High efficiency thermal interposer'19995,847,926'Lightweight packaging'19985,768,770'Electronic packaging shaped beam lead fabrication'19985,675,884'Apparatus for multilayer conductor chip packaging'19975,669,437'High efficiency thermal interposer'19975,446,261'Solder application system using helix to control solder meniscus'19955,322,204'Electronic substrate multiple location conductor attachment technology'19945,263,620'Wirebond removal apparatus using alternating fluid stream'19935,233,221'Electronic substrate multiple location conductor attachment technology'19935,229,328'Method for bonding dielectric mounted conductors to semiconductor chip contact pads'19935,205,461'Method and apparatus for fluxless solder bonding'19935,186,632'Electronic device elastomeric mounting and interconnection technology'19935,117,275'Electronic substrate multiple location conductor attachment technology'19925,093,890'Optical bus for computer systems'19925,093,879'Electro-optical connectors'19925,074,969'Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate'19915,047,834'High strength low stress encapsulation of interconnected semiconductor devices'19915,038,195'Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate'19915,006,925'Three dimensional microelectric packaging'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–2007Patents assigned to IBM (24)· patent assignee history
1991–2004Based in Peekskill, NY, US· patent location history
1995–2003Based in Yorktown Heights, NY, US· patent location history
2007Based in Chappaqua, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 24 | 1991–2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Peekskill, New York, US | 19 | 1991–2004 |
| Yorktown Heights, New York, US | 5 | 1995–2003 |
| Chappaqua, New York, US | 1 | 2007 |