Inventor
SEAN TEEHAN
Inventor
US
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10DInorganic electric semiconductor devices28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
B66BElevators3%
H05KPrinted circuits3%
PatentTitleYear
12,402,403Air gap spacer for metal gates202512,166,110Nanosheet channel-to-source and drain isolation202411,869,937Semiconductor device and method of forming the semiconductor device202411,869,936Semiconductor device and method of forming the semiconductor device202411,673,766Elevator analytics facilitating passenger destination prediction and resource optimization202311,652,161Nanosheet channel-to-source and drain isolation202311,646,235Vertical tunneling field effect transistor with dual liner bottom spacer202311,557,589Air gap spacer for metal gates202311,239,316Semiconductor device and method of forming the semiconductor device202211,152,252Semiconductor device with reduced contact resistance202111,152,266Vertical tunneling field effect transistor with dual liner bottom spacer2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to IBM (7)· patent assignee history
2021–2025Based in US· patent location history
2023Patents assigned to TESSERA LLC (2)· patent assignee history
2024–2025Patents assigned to ADEIA SEMICONDUCTOR SOLUTIONS LLC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 7 | 2021–2024 |
| ADEIA SEMICONDUCTOR SOLUTIONS LLC | 2 | 2024–2025 |
| TESSERA LLC | 2 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 11 | 2021–2025 |