Inventor
Swee Kah Lee
Inventor
Melaka, MY
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H01LSemiconductor devices27%
B81BMicrostructural devices or systems, e.g. micromechanical devices6%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
C09DCoating compositions, e.g. paints, varnishes or lacquers4%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers4%
B29CShaping or joining of plastics2%
B29LIndexing scheme associated with subclass b29c, relating to particular articles2%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds2%
PatentTitleYear
10,501,312Over-under sensor packaging with sensor spaced apart from control chip201910,431,560Molded semiconductor package having an optical inspection feature201910,396,007Semiconductor package with plateable encapsulant and a method for manufacturing the same201910,304,780Device having substrate with conductive pillars201910,163,812Device having substrate with conductive pillars201810,099,411Method and apparatus for simultaneously encapsulating semiconductor dies with layered lead frame strips20189,868,632'Molded cavity package with embedded conductive layer and enhanced sealing'20189,852,918Embedding additive particles in encapsulant of electronic device20179,806,043'Method of manufacturing molded semiconductor packages having an optical inspection feature'20179,540,539'Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device'20179,475,691'Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device'20169,287,238'Leadless semiconductor package with optical inspection feature'20169,219,025'Molded flip-clip semiconductor package'20158,945,990'Chip package and method of forming the same'20158,304,295'Method of manufacturing an electronic device with a package locking system'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2019Patents assigned to INFINEON TECHNOLOGIES AG (15)· patent assignee history
2012–2015Patents assigned to GOH SOON LOCK (2)· patent assignee history
2012–2015Patents assigned to LEE SWEE KAH (2)· patent assignee history
2012–2019Based in Melaka, MY· patent location history
2015Patents assigned to MENGEL MANFRED (1)· patent assignee history
2015Patents assigned to SCHMID STEFAN (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 15 | 2012–2019 |
| GOH SOON LOCK | 2 | 2012–2015 |
| LEE SWEE KAHself | 2 | 2012–2015 |
| MENGEL MANFRED | 1 | 2015 |
| SCHMID STEFAN | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Melaka, MY | 15 | 2012–2019 |