Inventor
Brett Arnold Dunlap
Inventor
Queen Creek, AZ, US
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H01LSemiconductor devices15%
G06KGraphical data reading11%
G06VImage or video recognition or understanding11%
G06FElectric digital data processing6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
G01NInvestigating or analysing materials by determining their chemical or physical properties5%
H05KPrinted circuits5%
H10DInorganic electric semiconductor devices5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
PatentTitleYear
11,119,615Fingerprint sensor and button combinations and methods of making same202110,636,717Packaging for fingerprint sensors and methods of manufacture2020RE047890Packaging for fingerprint sensors and methods of manufacture202010,546,833Method of forming a plurality of electronic component packages202010,338,754Edge-effect mitigation for capacitive sensors201910,325,132Fingerprint sensor and button combinations and methods of making same201910,055,631Semiconductor package for sensor applications20189,754,852'Packaging for fingerprint sensors and methods of manufacture'20179,691,734'Method of forming a plurality of electronic component packages'20179,651,513'Fingerprint sensor and button combinations and methods of making same'20179,013,011'Stacked and staggered die MEMS package and method'20158,941,250'Electronic component package fabrication method and structure'20158,937,381'Thin stackable package and method'20158,791,501'Integrated passive device structure and method'20148,753,730'Mechanical tape separation package'20148,653,674'Electronic component package fabrication method and structure'20148,535,961'Light emitting diode (LED) package and method'20138,432,022'Shielded embedded electronic component substrate fabrication method and structure'20138,337,657'Mechanical tape separation package and method'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2020Patents assigned to AMKOR TECHNOLOGY INC (14)· patent assignee history
2012–2017Patents assigned to DUNLAP BRETT ARNOLD (6)· patent assignee history
2012–2014Patents assigned to DARVEAUX ROBERT FRANCIS (2)· patent assignee history
2012–2021Based in Queen Creek, AZ, US· patent location history
2013–2014Patents assigned to DUNLAP BRETT (2)· patent assignee history
2017–2021Patents assigned to SYNAPTICS INC (5)· patent assignee history
2018Based in Gilbert, AZ, US· patent location history
2019Based in Phoenix, AZ, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECHNOLOGY INC | 14 | 2012–2020 |
| DUNLAP BRETT ARNOLDself | 6 | 2012–2017 |
| SYNAPTICS INC | 5 | 2017–2021 |
| DARVEAUX ROBERT FRANCIS | 2 | 2012–2014 |
| DUNLAP BRETTself | 2 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Queen Creek, AZ, US | 17 | 2012–2021 |
| Phoenix, AZ, US | 1 | 2019 |
| Gilbert, AZ, US | 1 | 2018 |