Inventor

Hirotaka Okamoto

Inventor

Aichi, JP

Overview

19→

Patents

2000–2018

Patent span

Chemistry

Primary field (CPC C)

Patents· 19 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C08Jprimary

C08JWorking-up17%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients17%

C08LCompositions of macromolecular compounds13%

Y02WClimate change mitigation technologies related to wastewater treatment or waste management9%

B29BPreparation or pretreatment of the material to be shaped7%

B29CShaping or joining of plastics7%

B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts4%

B82YSpecific uses or applications of nanostructures4%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%

B29LIndexing scheme associated with subclass b29c, relating to particular articles2%

PatentTitleYear

9,927,137'Air-conditioning control device generating air-conditioning control-data, air-conditioning control method, and computer program product'2018 9,840,615'Thermoplastic resin composition, method for producing same, and molded body'2017 9,728,294'Resin composite material'2017 9,586,787'Cord reel device'2017 9,493,642'Thermoplastic resin composition, method for producing same, and molded body'2016 7,910,643'Polylactic acid resin composition, moldings, and process for production thereof'2011 7,825,212'Polylactic acid resin and composition and molded article of the same'2010 7,585,910'Polylactic acid composition'2009 7,084,192'Polylactic acid composite material and molded body'2006 6,821,464'Process for producing polymer/filler composite material'2004 6,777,453'Method of reclaiming crosslinked rubber, and molded article of reclaimed rubber'2004 6,632,918'Method of reclaiming crosslinked rubber'2003 6,472,460'Polymer composite material and process for preparing the same'2002 6,438,826'Electronic component, method of sealing electronic component with resin, and apparatus therefor'2002 6,436,331'Method of resin sealing a gap between a semiconductor chip and a substrate'2002 6,316,508'Rubber composition and method for producing the same'2001 6,207,723'Rubber composition and method for producing the same'2001 6,178,156'Disk recording and reproduction apparatus and dynamic damper thereof'2001 6,117,932'Resin composite'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2004Patents assigned to TOYODA CHUO KENKYUSHO KK (7)· patent assignee history

2000–2017Based in Aichi, JP· patent location history

2001–2017Patents assigned to TOYOTA MOTOR CO LTD (7)· patent assignee history

2001–2004Patents assigned to TOYODA GOSEI KK (4)· patent assignee history

2001–2017Based in Osaka, JP· patent location history

2002Based in Kyoto, JP· patent location history

2009–2017Patents assigned to TOYOTA CHUO KENKYUSHO KK (4)· patent assignee history

2009–2017Based in Kariya, JP· patent location history

2017–2018Patents assigned to OKAMOTO HIROTAKA (2)· patent assignee history

2018Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TOYODA CHUO KENKYUSHO KK	7	2000–2004
TOYOTA MOTOR CO LTD	7	2001–2017
TOYODA GOSEI KK	4	2001–2004
TOYOTA CHUO KENKYUSHO KK	4	2009–2017
OKAMOTO HIROTAKAself	2	2017–2018

Locations

Location	Patents	Span
Aichi, JP	12	2000–2017
Kariya, JP	2	2009–2017
Osaka, JP	2	2001–2017
Kyoto, JP	2	2002
Tokyo, JP	1	2018