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Inventor

Li Huang

Inventor
Kaohsiung, TW

Overview

3→
Patents
2013–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

Y10Tprimary
Y10TTechnical subjects covered by former us classification22%
B21BRolling of metal11%
B22DCasting of metals11%
H01LSemiconductor devices11%
H05KPrinted circuits11%
H10DInorganic electric semiconductor devices11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
PatentTitleYear
10,586,751Semiconductor package device and method of manufacturing the same20209,914,167'Method of pre-controlling shapes of continuous-casting slab head and tail for reducing head and tail cut amount of hot rolling intermediate slab'20188,591,692'Method for manufacturing rigid-flexible printed circuit board'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2018Patents assigned to HUANG LI (2)· patent assignee history
2013Patents assigned to FUKUI PREC COMPONENT SHENZHEN (1)· patent assignee history
2013Based in Shenzhen, CN· patent location history
2018Patents assigned to BAOSHAN IRON & STEER CO LTD (1)· patent assignee history
2018Patents assigned to DING HONGRU (1)· patent assignee history
2018Based in Shanghai, CN· patent location history
2020Patents assigned to ADVANCED SEMICONDUCTOR ENG (1)· patent assignee history
2020Based in Kaohsiung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HUANG LIself22013–2018
ADVANCED SEMICONDUCTOR ENG12020
BAOSHAN IRON & STEER CO LTD12018
DING HONGRU12018
FUKUI PREC COMPONENT SHENZHEN12013
Locations
LocationPatentsSpan
Kaohsiung, TW12020
Shanghai, CN12018
Shenzhen, CN12013