Inventor
TSUNG-YU YANG
Inventor
TW
Overview
Patents· 32 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices24%
H10DInorganic electric semiconductor devices24%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
H10BElectronic memory devices8%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling2%
G05BControl or regulating systems in general2%
G06TImage data processing or generation, in general2%
G06VImage or video recognition or understanding2%
B25JManipulators1%
PatentTitleYear
12,568,691BCD device layout area defined by a deep trench isolation structure and methods for forming the same202612,507,484BCD device layout area defined by a deep trench isolation structure and methods for forming the same202512,471,329Semiconductor structures and manufacturing method thereof202512,402,378Semiconductor arrangement including first and second gate electrodes and method of manufacture202512,313,945Electronic device202512,279,446Manufacturing method of semiconductor device202512,266,577Deep trench isolation structure and method of making the same202512,211,906Method for eliminating divot formation and semiconductor device manufactured using the same202512,206,020High voltage semiconductor device202512,165,955Semiconductor arrangement and method for making202412,114,503Integrated chip including a tunnel dielectric layer which has different thicknesses over a protrusion region of a substrate202412,080,794Manufacturing method of high voltage semiconductor device202412,046,671Semiconductor device and manufacturing method thereof202412,002,883Semiconductor device and manufacturing method thereof202411,894,425Semiconductor arrangement and method of manufacture202411,854,942Semiconductor arrangement and method for making202311,855,071BCD device layout area defined by a deep trench isolation structure and methods for forming the same202311,810,300Method for detecting image of esophageal cancer using hyperspectral imaging202311,798,836Semiconductor isolation structure and method of making the same202311,774,392Chip crack detection structure202311,682,726High voltage semiconductor device and manufacturing method thereof202311,670,689Method for eliminating divot formation and semiconductor device manufactured using the same202311,580,637Method for detecting image of object using convolutional neural network202311,575,008Semiconductor arrangement and method of manufacture202311,532,637Embedded flash memory cell including a tunnel dielectric layer having different thicknesses over a memory region202211,515,404Semiconductor structure comprising regions having an isolation trench with a stepped bottom surface therebetween and method of forming the same202211,506,489Contour accuracy measuring system and contour accuracy measuring method202211,450,574Deep trench isolation structure and method of making the same202211,404,305Manufacturing method of isolation structures for semiconductor devices202211,342,025Non-volatile memory device202211,331,762Method for synchronous control of gantry mechanism with online inertia matching202211,189,546Semiconductor arrangement and method for making2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (18)· patent assignee history
2021–2026Based in TW· patent location history
2022–2025Patents assigned to UNITED MICROELECTRONICS CORP (9)· patent assignee history
2022Patents assigned to IND TECH RES INST (2)· patent assignee history
2023Patents assigned to UNIV NAT CHUNG CHENG (2)· patent assignee history
2025Patents assigned to INNOLUX CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 18 | 2021–2026 |
| UNITED MICROELECTRONICS CORP | 9 | 2022–2025 |
| IND TECH RES INST | 2 | 2022 |
| UNIV NAT CHUNG CHENG | 2 | 2023 |
| INNOLUX CORP | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 32 | 2021–2026 |