Inventor
Sabina J. Houle
Inventor
Phoenix, AZ, US
Overview
Patents· 44 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1051%
Y10TTechnical subjects covered by former us classification19%
B23KSoldering or unsoldering7%
H05KPrinted circuits7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
B05BSpraying apparatus3%
B05CApparatus for applying fluent materials to surfaces, in general3%
H01LSemiconductor devices3%
B29CShaping or joining of plastics1%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts1%
PatentTitleYear
9,180,541'Rotational-flow spray nozzle and process of using same'20159,142,480'Microelectronic package with high temperature thermal interface material'20158,987,894'Underfill process and materials for singulated heat spreader stiffener for thin core panel processing'20158,765,528'Underfill process and materials for singulated heat spreader stiffener for thin core panel processing'20148,390,112'Underfill process and materials for singulated heat spreader stiffener for thin core panel processing'20138,308,047'Compliant spray flux masks, systems, and methods'20128,215,536'Rotational-flow spray nozzle and process of using same'20128,067,256'Method of making microelectronic package using integrated heat spreader stiffener panel and microelectronic package formed according to the method'20118,013,439'Injection molded metal stiffener for packaging applications'20117,996,989'Heat dissipating device with preselected designed interface for thermal interface materials'20117,846,778'Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly'20107,821,126'Heat sink with preattached thermal interface material and method of making same'20107,723,160'Thermal interface structure with integrated liquid cooling and methods'20107,654,433'Flux overspray removal masks with channels, methods of assembling same, and systems containing same'20107,644,871'Flux spray atomization and splash control'20107,629,203'Thermal interface material for combined reflow'20097,588,968'Linked chip attach and underfill'20097,534,650'Carbon-carbon and/or metal-carbon fiber composite heat spreader'20097,527,090'Heat dissipating device with preselected designed interface for thermal interface materials'20097,473,995'Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly'20097,421,780'Methods for fabricating thermal management systems for micro-components'20087,416,922'Heat sink with preattached thermal interface material and method of making same'20087,364,943'Method of bonding a microelectronic die to a substrate and arrangement to carry out method'20087,358,606'Apparatus to compensate for stress between heat spreader and thermal interface material'20087,327,027'Thermal interface structure with integrated liquid cooling and methods'20087,304,381'Package and method for attaching an integrated heat spreader'20077,218,000'Liquid solder thermal interface material contained within a cold-formed barrier and methods of making same'20077,195,951'Carbon-carbon and/or metal-carbon fiber composite heat spreaders'20077,190,585'Thermal heat spreaders designed for lower cost manufacturability, lower mass and increased thermal performance'20077,183,140'Injection molded metal bonding tray for integrated circuit device fabrication'20077,030,485'Thermal interface structure with integrated liquid cooling and methods'20067,019,971'Thermal management systems for micro-components'20067,014,093'Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same'20067,015,073'Method of forming heat spreader with down set leg attachment feature'20066,987,671'Composite thermal interface devices and methods for integrated circuit heat transfer'20066,882,535'Integrated heat spreader with downset edge, and method of making same'20056,867,978'Integrated heat spreader package for heat transfer and for bond line thickness control and process of making'20056,837,306'Carbon-carbon and/or metal-carbon fiber composite heat spreaders'20056,773,963'Apparatus and method for containing excess thermal interface material'20046,756,669'Heat spreader with down set leg attachment feature'20046,748,350'Method to compensate for stress between heat spreader and thermal interface material'20046,504,242'Electronic assembly having a wetting layer on a thermally conductive heat spreader'20036,469,381'Carbon-carbon and/or metal-carbon fiber composite heat spreader'20025,544,458'Vehicle panel assembly'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996Based in Holland, MI, US· patent location history
2002–2015Patents assigned to INTEL CORP (43)· patent assignee history
2002–2015Based in Phoenix, AZ, US· patent location history
2004Based in Chandler, AZ, US· patent location history
2010Based in Phoeniz, AZ, US· patent location history
2011–2015Patents assigned to HOULE SABINA J (6)· patent assignee history
2011–2014Patents assigned to MELLODY JAMES P (3)· patent assignee history
2012–2015Patents assigned to DESHPANDE NITIN (2)· patent assignee history
2012–2015Patents assigned to RAMANAN HARIKRISHNAN (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 43 | 2002–2015 |
| HOULE SABINA Jself | 6 | 2011–2015 |
| MELLODY JAMES P | 3 | 2011–2014 |
| DESHPANDE NITIN | 2 | 2012–2015 |
| RAMANAN HARIKRISHNAN | 2 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Phoenix, AZ, US | 41 | 2002–2015 |
| Phoeniz, AZ, US | 1 | 2010 |
| Chandler, AZ, US | 1 | 2004 |
| Holland, MI, US | 1 | 1996 |