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Inventor

Yung-Liang Kuo

Inventor
Hsinchu, TW

Overview

3→
Patents
2009–2012
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Rprimary
G01RMeasuring electric variables33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
8,248,091'Universal array type probe card design for semiconductor device testing'20127,781,235'Chip-probing and bumping solutions for stacked dies having through-silicon vias'20107,598,523'Test structures for stacking dies having through-silicon vias'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2012Patents assigned to TAIWAN SEMICONDUCTOR MFG (3)· patent assignee history
2009–2012Based in Hsinchu, TW· patent location history
2012Patents assigned to CHENG HSU MING (1)· patent assignee history
2012Patents assigned to HWANG FRANK (1)· patent assignee history
2012Patents assigned to KUO YUNG-LIANG (1)· patent assignee history
2012Patents assigned to LEE PI-HUANG (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG32009–2012
CHENG HSU MING12012
HWANG FRANK12012
KUO YUNG-LIANGself12012
LEE PI-HUANG12012
Locations
LocationPatentsSpan
Hsinchu, TW32009–2012