Inventor
Aurelio LOPEZ
Inventor
US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
B23KSoldering or unsoldering8%
G01RMeasuring electric variables8%
H05KPrinted circuits8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
PatentTitleYear
12,444,712Integrated mechanical aids for high accuracy alignable-electrical contacts202512,057,429Temporary bonding structures for die-to-die and wafer-to-wafer bonding202411,562,984Integrated mechanical aids for high accuracy alignable-electrical contacts202311,555,830Small pitch integrated knife edge temporary bonding microstructures202311,540,399System and method for bonding a cable to a substrate using a die bonder2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to HRL LAB LLC (5)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HRL LAB LLC | 5 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 5 | 2022–2025 |