Inventor
Richard P. Snider
Inventor
New Paltz, NY, US
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits33%
Y10TTechnical subjects covered by former us classification17%
F16LPipes8%
F24FAir-conditioning8%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact8%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
G06FElectric digital data processing4%
H01LSemiconductor devices4%
PatentTitleYear
9,913,403'Flexible coolant manifold—heat sink assembly'20189,648,786'Interlock assembly for air-moving assembly'20179,629,284'Interlock assembly for air-moving assembly'20179,504,184'Flexible coolant manifold-heat sink assembly'20169,497,888'Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s)'20169,298,231'Methods of fabricating a coolant-cooled electronic assembly'20169,265,178'Thermal transfer and coolant-cooled structures facilitating cooling of electronics card(s)'20169,253,923'Fabricating thermal transfer and coolant-cooled structures for cooling electronics card(s)'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2018Patents assigned to IBM (8)· patent assignee history
2016–2018Based in New Paltz, NY, US· patent location history
2018Patents assigned to INT BUSINESS MACHINES CORPORATIONS (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 8 | 2016–2018 |
| INT BUSINESS MACHINES CORPORATIONS | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| New Paltz, New York, US | 8 | 2016–2018 |