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Inventor

Cheng-Fan Lin

Inventor
Hsinchu County, TW

Overview

4→
Patents
2009–2013
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1075%
H10KOrganic electric solid-state devices25%
PatentTitleYear
8,530,344'Method for manufacturing fine-pitch bumps and structure thereof'20138,501,614'Method for manufacturing fine-pitch bumps and structure thereof'20138,497,579'Semiconductor packaging method and structure thereof'20137,564,183'Organic electroluminescent display panel with dummy areas'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2013Based in Hsinchu County, TW· patent location history
2013Patents assigned to CHIPBOND TECHNOLOGY CORP (3)· patent assignee history
2013Patents assigned to HSIEH YUNG-WEI (3)· patent assignee history
2013Patents assigned to LIN CHENG-FAN (3)· patent assignee history
2013Patents assigned to LIN SHU-CHEN (3)· patent assignee history
2013Patents assigned to SHIH CHENG-HUNG (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHIPBOND TECHNOLOGY CORP32013
HSIEH YUNG-WEI32013
LIN CHENG-FANself32013
LIN SHU-CHEN32013
SHIH CHENG-HUNG32013
Locations
LocationPatentsSpan
Hsinchu County, TW42009–2013