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Inventor

Clinton Adams

Inventor
Coeur d'Alene, ID, US

Overview

27→
Patents
2008–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 27 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices19%
H10HInorganic light-emitting semiconductor devices having potential barriers19%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein15%
G06FElectric digital data processing3%
H01HElectric switches3%
H04LTransmission of digital information, e.g. telegraphic communication2%
G02BOptical elements, systems or apparatus1%
G03GElectrography1%
PatentTitleYear
10,818,449Apparatus and method of backlighting through a cover on the apparatus202010,636,770Apparatus and method for direct transfer of semiconductor devices from a substrate and stacking semiconductor devices on each other202010,629,393Apparatus and method of backlighting through a cover on the apparatus202010,622,337Method and apparatus for transfer of semiconductor devices202010,615,153Apparatus for direct transfer of semiconductor device die202010,615,152Semiconductor device on glass substrate202010,566,319Apparatus for direct transfer of semiconductor device die202010,490,532Apparatus and method for direct transfer of semiconductor devices201910,381,176Keyboard backlighting with deposited light-generating sources201910,373,937Apparatus for multi-direct transfer of semiconductors201910,354,895Support substrate for transfer of semiconductor devices201910,325,885Semiconductor device on string circuit and method of making the same201910,290,615Method and apparatus for improved direct transfer of semiconductor die201910,242,971Apparatus for direct transfer of semiconductor devices with needle retraction support201910,203,627Electrophotographic deposition of unpackaged semiconductor device201910,193,031Method for applying phosphor to light emitting diodes and apparatus thereof201910,170,454Method and apparatus for direct transfer of semiconductor device die from a mapped wafer201910,157,896Method and apparatus for light diffusion201810,141,215Compliant needle for direct transfer of semiconductor devices201810,062,588Flexible support substrate for transfer of semiconductor devices20189,985,003Substrate with array of LEDs for backlighting a display device20189,871,023'Method for transfer of semiconductor devices'20189,748,210'Method for transfer of semiconductor devices'20179,678,383'Method and apparatus for light diffusion'20179,633,883'Apparatus for transfer of semiconductor devices'20177,725,589'System, method, apparatus, and computer program product for facilitating digital communications'20107,395,341'System, method, apparatus and computer program product for facilitating digital communications'2008

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2008–2010Patents assigned to FIBERLINK COMM CORP (2)· patent assignee history
2008–2010Based in Collegeville, PA, US· patent location history
2017–2020Patents assigned to ROHINNI LLC (24)· patent assignee history
2017Patents assigned to ROHINNI INC (1)· patent assignee history
2017–2020Based in Coeur d'Alene, ID, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ROHINNI LLC242017–2020
FIBERLINK COMM CORP22008–2010
ROHINNI INC12017
Locations
LocationPatentsSpan
Coeur d'Alene, ID, US252017–2020
Collegeville, Pennsylvania, US22008–2010