Inventor
Jeffrey A. Ridley
Inventor
Shorewood, MN, US
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices17%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems13%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light13%
Y10TTechnical subjects covered by former us classification11%
H10NElectric solid-state devices not otherwise provided for10%
G01FMeasuring volume, volume flow, mass flow or liquid level8%
H01HElectric switches6%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
B29CShaping or joining of plastics3%
PatentTitleYear
8,188,561'Integral topside vacuum package'20127,875,944'Integral topside vacuum package'20117,549,206'Shell flow sensor'20097,396,698'Methods and systems for providing MEMS devices with a top cap and upper sense plate'20087,396,476'Method for reducing harmonic distortion in comb drive devices'20087,276,798'Integral topside vacuum package'2007RE039143'Method for making a wafer-pair having sealed chambers'20067,012,322'Method for reducing harmonic distortion in comb drive devices'20067,005,732'Methods and systems for providing MEMS devices with a top cap and upper sense plate'20066,924,165'Methods and systems for buried electrical feedthroughs in a glass-silicon MEMS process'20056,888,233'Systems for buried electrical feedthroughs in a glass-silicon MEMS process'20056,808,956'Thin micromachined structures'20046,582,985'SOI/glass process for forming thin silicon micromachined structures'20036,359,333'Wafer-pair having deposited layer sealed chambers'20026,287,940'Dual wafer attachment process'20016,246,305'Apparatus and method for operating a micromechanical switch'20016,040,749'Apparatus and method for operating a micromechanical switch'20006,036,872'Method for making a wafer-pair having sealed chambers'20005,895,233'Integrated silicon vacuum micropackage for infrared devices'19994,914,742'Thin film orthogonal microsensor for air flow and method'19904,895,616'Method for making thin film orthogonal microsensor for air flow'19904,891,977'Microbridge sensor bonding pad design for improved adhesion'19904,784,721'Integrated thin-film diaphragm; backside etch'1988Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1988–2000Patents assigned to HONEYWELL INC (7)· patent assignee history
1988–2006Based in Burnsville, MN, US· patent location history
2001–2012Patents assigned to HONEYWELL INT INC (16)· patent assignee history
2003–2012Based in Shorewood, MN, US· patent location history
2012Patents assigned to HIGASHI ROBERT E (1)· patent assignee history
2012Patents assigned to NEWSTROM-PEITSO KAREN M (1)· patent assignee history
2012Patents assigned to RIDLEY JEFFREY A (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HONEYWELL INT INC | 16 | 2001–2012 |
| HONEYWELL INC | 7 | 1988–2000 |
| HIGASHI ROBERT E | 1 | 2012 |
| NEWSTROM-PEITSO KAREN M | 1 | 2012 |
| RIDLEY JEFFREY Aself | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shorewood, Minnesota, US | 12 | 2003–2012 |
| Burnsville, Minnesota, US | 11 | 1988–2006 |